参数资料
| 型号： | ISL85001IRZ-T |
| 厂商： | Intersil |
| 文件页数： | 15/17页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK ADJ 1A 12DFN |
| 标准包装： | 6,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.6 V ~ 19 V |
| 输入电压： | 4.5 V ~ 25 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 500kHz |
| 电流 - 输出： | 1A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 12-DFN（4x3） |
ISL85001
As an example, consider the turn-off transition of the upper MOSFET.
Prior to turn-off, the MOSFET is carrying the full load current. During
turn-off, current stops flowing in the MOSFET and is picked up by the
Schottky diode. Any parasitic inductance in the switched current
path generates a large voltage spike during the switching interval.
Careful component selection, tight layout of the critical components,
and short, wide traces minimizes the magnitude of voltage spikes.
ISL85001
VIN
V IN
C IN
L
V OUT1
There are two sets of critical components in the ISL85001
switching converter. The switching components are the most
critical because they switch large amounts of energy, and
therefore tend to generate large amounts of noise. Next are the
small signal components, which connect to sensitive nodes or
supply critical bypass current and signal coupling.
A multi-layer printed circuit board is recommended. Figure 23
shows the connections of the critical components in the converter.
5V
C BP1
VDD
PHASE
GND
COMP
FB
D
C 2
R 2
R 4
C OUT1
C 1
R 1
C 3
R 3
Note that capacitors C IN and C OUT could each represent numerous
physical capacitors. Dedicate one solid layer, usually a middle layer
of the PC board, for a ground plane and make all critical
GND PAD
component ground connections with vias to this layer. Dedicate
another solid layer as a power plane and break this plane into
smaller islands of common voltage levels. Keep the metal runs
from the PHASE terminals to the output inductor short. The power
KEY
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT AND/OR POWER PLANE LAYER
plane should support the input power and output power nodes.
Use copper filled polygons on the top and bottom circuit layers for
the phase nodes. Use the remaining printed circuit layers for small
signal wiring.
In order to dissipate heat generated by the internal LDO and
MOSFET, the ground pad, pin 13, should be connected to the
internal ground plane through at least four vias. This allows the
heat to move away from the IC and also ties the pad to the
ground plane through a low impedance path.
15
VIA CONNECTION TO GROUND PLANE
FIGURE 23. PRINTED CIRCUIT BOARD POWER PLANES AND
ISLANDS
The switching components should be placed close to the
ISL85001 first. Minimize the length of the connections between
the input capacitors, C IN , and the power switches by placing
them nearby. Position both the ceramic and bulk input capacitors
as close to the upper MOSFET drain as possible. Position the
output inductor and output capacitors between the upper and
Schottky diode and the load.
The critical small signal components include any bypass
capacitors, feedback components, and compensation
components. Place the PWM converter compensation
components close to the FB and COMP pins. The feedback
resistors should be located as close as possible to the FB pin with
vias tied straight to the ground plane as required.
FN6769.2
May 29, 2012
相关PDF资料 |
PDF描述 |
|---|---|
| ISL8500IRZ-T | IC REG BUCK ADJ 2A 12DFN |
| ISL8502AIRZ | IC REG BUCK SYNC ADJ 2A 24QFN |
| ISL8502IRZ | IC REG BUCK SYNC ADJ 2.5A 24QFN |
| ISL85033IRTZ | IC REG BUCK SYNC ADJ 3A 28TQFN |
| ISL85402IRZ | IC REG BUCK BOOST SYNC ADJ 20QFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL8500EVAL1Z | 功能描述:EVALUATION BOARD FOR ISL8500 RoHS:是 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC，步升 输出及类型:1，非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
| ISL8500EVAL2Z | 功能描述:EVAL BOARD 2 FOR ISL8500 RoHS:是 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:* 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC，步升 输出及类型:1，非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
| ISL8500IRZ | 功能描述:电压模式 PWM 控制器 2A STD BUCK REG 4X3 DFN RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| ISL8500IRZ-T | 功能描述:IC REG BUCK ADJ 2A 12DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:降压（降压） 输出类型:两者兼有 输出数:1 输出电压:5V，1 V ~ 10 V 输入电压:3.5 V ~ 28 V PWM 型:电流模式 频率 - 开关:220kHz ~ 1MHz 电流 - 输出:600mA 同步整流器:无 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SSOP（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:16-QSOP |
| ISL8501EVAL1Z | 功能描述:EVALUATION BOARD FOR ISL8501 RoHS:是 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC，步升 输出及类型:1，非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
发布紧急采购，3分钟左右您将得到回复。