参数资料
| 型号： | ISL97702IRZ-T7 |
| 厂商： | Intersil |
| 文件页数： | 13/13页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST ADJ 0.13A DL 10DFN |
| 标准包装： | 1,000 |
| 类型： | 升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 2 |
| 输出电压： | 可调至 28V |
| 输入电压： | 2.3 V ~ 5.5 V |
| 频率 - 开关： | 1MHz |
| 电流 - 输出： | 130mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 10-DFN（3x3） |
ISL97702
Dual Flat No-Lead Package Family (DFN)
A
D
MDP0047
DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229)
N N-1
0.075 C
SYMBOL
A
DFN8
0.85
DFN10
0.90
TOLERANCE
±0.10
2X
A1
0.02
0.02
+0.03/-0.02
E
PIN #1
I.D.
b
c
D
0.30
0.20
4.00
0.25
0.20
3.00
±0.05
Reference
Basic
1
2
0.075 C
D2
3.00
2.25
Reference
B
TOP VIEW
2X
E
4.00
3.00
Basic
E2
2.20
1.50
Reference
L1
4
(D2)
N-1
N
e
L
L1
0.80
0.50
0.10
0.50
0.50
0
Basic
±0.10
Maximum
(E2)
L
(N LEADS)
Rev. 1 10/03
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Exposed lead at side of package is a non-functional feature.
3. Bottom-side pin #1 I.D. may be a diepad chamfer, an extended
PIN #1 I.D.
3
tiebar tab, or a small square as shown.
2
1
4. Exposed leads may extend to the edge of the package or be
5
e
b
0.10 M C A B
pulled back. See dimension “L1”.
5. Inward end of lead may be square or circular in shape with radius
BOTTOM VIEW
(b/2) as shown.
6. N is the total number of leads on the device.
C
SEATING
PLANE
0.10
C
0.08
C
SEE DETAIL "X"
(N LEADS
& EXPOSED PAD)
2
C
A
(c)
A1
DETAIL X
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
13
FN7462.0
October 13, 2005
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