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参数资料
| 型号： | ISO7221AQDRQ1 |
| 厂商： | Texas Instruments |
| 文件页数： | 18/24页 |
| 文件大小： | 0K |
| 描述： | IC DGTL ISOLATOR 1MBPS DL 8SOIC |
| 标准包装： | 1 |
| 输入 - 1 侧/2 侧： | 1/1 |
| 通道数： | 2 |
| 电源电压： | 3 V ~ 5.5 V |
| 电压 - 隔离： | 2500Vrms |
| 数据速率： | 1Mbps |
| 传输延迟： | 410ns |
| 输出类型： | CMOS |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 125°C |
| 其它名称： | 296-27336-6 |
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
11-Apr-2013
Orderable Device
Status
Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
(1)
Drawing
Qty
(2)
(3)
(4)
ISO7220AQDRQ1
ACTIVE
SOIC
D
8
2500
Green (RoHS
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
7220AQ
& no Sb/Br)
ISO7221AQDRQ1
ACTIVE
SOIC
D
8
2500
Green (RoHS
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
7221AQ
& no Sb/Br)
ISO7221CQDRQ1
ACTIVE
SOIC
D
8
2500
Green (RoHS
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
7221CQ
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
(4)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISO7221B | 制造商:TI 制造商全称:Texas Instruments 功能描述:DUAL DIGITAL ISOLATORS |
| ISO7221BD | 功能描述:隔离器接口集成电路 Dual Channel 1/1 5 Mbps Dig Isolator RoHS:否 制造商:Texas Instruments 通道数量:2 传播延迟时间: 电源电压-最大:5.5 V 电源电压-最小:3 V 电源电流:3.6 mA 功率耗散: 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:SOIC-8 封装:Tube |
| ISO7221BD | 制造商:Texas Instruments 功能描述:IC DIGITAL ISOLATOR 70NS SOIC-8 制造商:Texas Instruments 功能描述:IC, DIGITAL ISOLATOR, 70NS, SOIC-8 |
| ISO7221BDG4 | 功能描述:隔离器接口集成电路 Dual Channel 1/1 5Mbps Dig Isolator RoHS:否 制造商:Texas Instruments 通道数量:2 传播延迟时间: 电源电压-最大:5.5 V 电源电压-最小:3 V 电源电流:3.6 mA 功率耗散: 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:SOIC-8 封装:Tube |
| ISO7221BDR | 功能描述:隔离器接口集成电路 Dual Channel High Spd Digital Isolator RoHS:否 制造商:Texas Instruments 通道数量:2 传播延迟时间: 电源电压-最大:5.5 V 电源电压-最小:3 V 电源电流:3.6 mA 功率耗散: 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:SOIC-8 封装:Tube |
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