参数资料
型号: IXFK240N15T2
厂商: IXYS
文件页数: 2/6页
文件大小: 0K
描述: MOSFET N-CH 150V 240A TO264
标准包装: 25
系列: GigaMOS™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 150V
电流 - 连续漏极(Id) @ 25° C: 240A
开态Rds(最大)@ Id, Vgs @ 25° C: 5.2 毫欧 @ 60A,10V
Id 时的 Vgs(th)(最大): 5V @ 8mA
闸电荷(Qg) @ Vgs: 460nC @ 10V
输入电容 (Ciss) @ Vds: 32000pF @ 25V
功率 - 最大: 1250W
安装类型: 通孔
封装/外壳: TO-264-3,TO-264AA
供应商设备封装: TO-264
包装: 管件
IXFK240N15T2
IXFX240N15T2
Symbol Test Conditions
(T J = 25 ° C Unless Otherwise Specified)
Characteristic Values
Min. Typ. Max.
TO-264 (IXFK) Outline
g fs
C iss
C oss
C rss
R Gi
V DS = 10V, I D = 60A, Note 1
V GS = 0V, V DS = 25V, f = 1MHz
Gate Input Resistance
125
210
32
2280
270
1.50
S
nF
pF
pF
Ω
t d(on)
t r
t d(off)
t f
Q g(on)
Q gs
Q gd
Resistive Switching Times
V GS = 10V, V DS = 0.5 ? V DSS , I D = 0.5 ? I D25
R G = 1 Ω (External)
V GS = 10V, V DS = 0.5 ? V DSS , I D = 0.5 ? I D25
48
125
77
145
460
125
130
ns
ns
ns
ns
nC
nC
nC
Dim.
A
A1
A2
b
b1
b2
c
Millimeter
Min. Max.
4.82 5.13
2.54 2.89
2.00 2.10
1.12 1.42
2.39 2.69
2.90 3.09
0.53 0.83
Inches
Min. Max.
.190 .202
.100 .114
.079 .083
.044 .056
.094 .106
.114 .122
.021 .033
R thJC
R thCS
0.15
0.12
° C/W
° C/W
D
E
e
J
25.91 26.16
19.81 19.96
5.46 BSC
0.00 0.25
1.020 1.030
.780 .786
.215 BSC
.000 .010
K
L
L1
P
Q
0.00 0.25
20.32 20.83
2.29 2.59
3.17 3.66
6.07 6.27
.000 .010
.800 .820
.090 .102
.125 .144
.239 .247
Source-Drain Diode
Q1
R
R1
8.38 8.69
3.81 4.32
1.78 2.29
.330 .342
.150 .170
.070 .090
Symbol Test Conditions
(T J = 25 ° C, Unless Otherwise Specified)
Characteristic Values
Min. Typ. Max.
S
T
6.04 6.30
1.57 1.83
.238 .248
.062 .072
I S
I SM
V SD
V GS = 0V
Repetitive, Pulse Width Limited by T JM
I F = 100A, V GS = 0V, Note 1
240
960
1.2
A
A
V
PLUS 247 TM (IXFX) Outline
t rr
Q RM
I RM
I F = 120A, -di/dt = 100A/ μ s
V R = 75V, V GS = 0V
410
8.2
140
ns
nC
A
Note 1. Pulse test, t ≤ 300 μ s; duty cycle, d ≤ 2%.
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
Dim.
A
Millimeter
Min. Max.
4.83 5.21
Inches
Min. Max.
.190 .205
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
A 1
A 2
b
b 1
b 2
C
D
E
e
L
L1
Q
R
2.29 2.54
1.91 2.16
1.14 1.40
1.91 2.13
2.92 3.12
0.61 0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81 4.32
5.59 6.20
4.32 4.83
.090 .100
.075 .085
.045 .055
.075 .084
.115 .123
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
IXYS MOSFETs and IGBTs are covered
4,835,592
4,931,844
5,049,961
5,237,481
6,162,665
6,404,065 B1
6,683,344 6,727,585 7,005,734 B2
7,157,338B2
by one or more of the following U.S. patents: 4,850,072
5,017,508
5,063,307
5,381,025
6,259,123 B1
6,534,343
6,710,405 B2 6,759,692 7,063,975 B2
4,881,106
5,034,796
5,187,117
5,486,715
6,306,728 B1
6,583,505
6,710,463
6,771,478 B2 7,071,537
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