参数资料
型号: IXFK32N100P
厂商: IXYS
文件页数: 2/4页
文件大小: 0K
描述: MOSFET N-CH 1000V 32A TO-264
标准包装: 25
系列: Polar™ HiPerFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 1000V(1kV)
电流 - 连续漏极(Id) @ 25° C: 32A
开态Rds(最大)@ Id, Vgs @ 25° C: 320 毫欧 @ 16A,10V
Id 时的 Vgs(th)(最大): 6.5V @ 1mA
闸电荷(Qg) @ Vgs: 225nC @ 10V
输入电容 (Ciss) @ Vds: 14200pF @ 25V
功率 - 最大: 960W
安装类型: 通孔
封装/外壳: TO-264-3,TO-264AA
供应商设备封装: TO-264
包装: 管件
IXFK32N100P
IXFX32N100P
Symbol Test Conditions
(T J = 25 ° C unless otherwise specified)
Characteristic Values
Min. Typ. Max.
TO-264 (IXFK) Outline
g fs
C iss
C oss
C rss
R Gi
t d(on)
t r
V DS = 20V, I D = 0.5 ? I D25 , Note 1
V GS = 0V, V DS = 25V, f = 1MHz
Gate input resistance
Resistive Switching Times
V GS = 10V, V DS = 0.5 ? V DSS , I D = 0.5 ? I D25
13
21
14.2
815
60
1.50
50
55
S
nF
pF
pF
Ω
ns
ns
t d(off)
t f
Q g(on)
Q gs
Q gd
R thJC
R thCS
R G = 1 Ω (External)
V GS = 10V, V DS = 0.5 ? V DSS , I D = 0.5 ? I D25
76
43
225
85
94
0.15
0.13
ns
ns
nC
nC
nC
° C/W
° C/W
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
Millimeter
Min. Max.
4.82 5.13
2.54 2.89
2.00 2.10
1.12 1.42
2.39 2.69
2.90 3.09
0.53 0.83
25.91 26.16
19.81 19.96
5.46 BSC
0.00 0.25
0.00 0.25
Inches
Min. Max.
.190 .202
.100 .114
.079 .083
.044 .056
.094 .106
.114 .122
.021 .033
1.020 1.030
.780 .786
.215 BSC
.000 .010
.000 .010
L
L1
20.32 20.83
2.29 2.59
.800 .820
.090 .102
Source-Drain Diode
P
Q
Q1
3.17 3.66
6.07 6.27
8.38 8.69
.125 .144
.239 .247
.330 .342
Symbol Test Conditions
(T J = 25 ° C unless otherwise specified)
Characteristic Values
Min. Typ. Max.
R
R1
S
T
3.81 4.32
1.78 2.29
6.04 6.30
1.57 1.83
.150 .170
.070 .090
.238 .248
.062 .072
I S
I SM
V SD
V GS = 0V
Repetitive, pulse width limited by T JM
I F = I S , V GS = 0V, Note 1
32
128
1.5
A
A
V
PLUS 247 TM (IXFX) Outline
t rr
Q RM
I RM
I F = 16A, -di/dt = 100A/ μ s
V R = 100V, V GS = 0V
2.2
15
300
ns
μ C
A
Note 1: Pulse test, t ≤ 300 μ s; duty cycle, d ≤ 2%.
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
Dim.
A
Millimeter
Min. Max.
4.83 5.21
Inches
Min. Max.
.190 .205
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS reserves the right to change limits, test conditions, and dimensions.
A 1
A 2
b
b 1
b 2
C
D
E
e
L
L1
Q
R
2.29 2.54
1.91 2.16
1.14 1.40
1.91 2.13
2.92 3.12
0.61 0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81 4.32
5.59 6.20
4.32 4.83
.090 .100
.075 .085
.045 .055
.075 .084
.115 .123
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
IXYS MOSFETs and IGBTs are covered
4,835,592
4,931,844
5,049,961
5,237,481
6,162,665
6,404,065 B1
6,683,344 6,727,585 7,005,734 B2
7,157,338B2
by one or more of the following U.S. patents: 4,850,072
5,017,508
5,063,307
5,381,025
6,259,123 B1
6,534,343
6,710,405 B2 6,759,692 7,063,975 B2
4,881,106
5,034,796
5,187,117
5,486,715
6,306,728 B1
6,583,505
6,710,463
6,771,478 B2 7,071,537
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