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| 型号： | IXTY08N50D2 |
| 厂商： | IXYS |
| 文件页数： | 2/5页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 500V 800MA DPAK |
| 产品目录绘图： | TO-252(AA), DPAK-2 Package |
| 标准包装： | 75 |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 耗尽模式 |
| 漏极至源极电压(Vdss)： | 500V |
| 电流 - 连续漏极(Id) @ 25° C： | 800mA |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 4.6 欧姆 @ 400mA，0V |
| 闸电荷(Qg) @ Vgs： | 12.7nC @ 5V |
| 输入电容 (Ciss) @ Vds： | 312pF @ 25V |
| 功率 - 最大： | 60W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-252-3，DPak（2 引线+接片），SC-63 |
| 供应商设备封装： | TO-252，（D-Pak） |
| 包装： | 管件 |
IXTY08N50D2
IXTA08N50D2
IXTP08N50D2
Symbol Test Conditions
(T J = 25 ° C, Unless Otherwise Specified)
Characteristic Values
Min. Typ. Max.
TO-252 AA (IXTY) Outline
g fs
C iss
C oss
C rss
V DS = 30V, I D = 400mA, Note 1
V GS = -10V, V DS = 25V, f = 1MHz
340
570
312
35
11
mS
pF
pF
pF
t d(on)
t r
t d(off)
t f
Resistive Switching Times
V GS = ± 5V, V DS = 250V, I D = 400mA
R G = 10 Ω (External)
28
54
35
52
ns
ns
ns
ns
1.
2.
3.
4.
Gate
Drain
Source
Drain
Bottom Side
Q g(on)
12.7
nC
Dim.
Millimeter
Inches
Q gs
Q gd
V GS = 5V, V DS = 250V, I D = 400mA
1.2
7.3
nC
nC
A
A1
Min. Max.
2.19 2.38
0.89 1.14
Min. Max.
0.086 0.094
0.035 0.045
R thJC
R thCS
TO-220
0.50
2.08 ° C/W
° C/W
A2
b
b1
b2
0
0.64
0.76
5.21
0.13
0.89
1.14
5.46
0
0.025
0.030
0.205
0.005
0.035
0.045
0.215
c
0.46
0.58
0.018
0.023
Safe-Operating-Area Specification
Characteristic Values
c1
D
D1
0.46
5.97
4.32
0.58
6.22
5.21
0.018
0.235
0.170
0.023
0.245
0.205
Symbol
Test Conditions
Min. Typ. Max.
E
E1
6.35
4.32
6.73
5.21
0.250
0.170
0.265
0.205
SOA
V DS = 400V, I D = 90mA, T C = 75 ° C, Tp = 5s
36
W
e
e1
2.28 BSC
4.57 BSC
0.090 BSC
0.180 BSC
H
L
9.40 10.42
0.51 1.02
0.370
0.020
0.410
0.040
Source-Drain Diode
Symbol Test Conditions
(T J = 25 ° C, Unless Otherwise Specified)
Characteristic Values
Min. Typ. Max.
L1
L2
L3
0.64
0.89
2.54
1.02
1.27
2.92
0.025
0.035
0.100
0.040
0.050
0.115
V SD
t rr
I RM
Q RM
I F = 800mA, V GS = -10V, Note 1
I F = 800mA, -di/dt = 100A/ μ s
V R = 100V, V GS = -10V
0.8
400
5.2
1.04
1.3
V
ns
A
μ C
TO-220 (IXTP) Outline
Note 1. Pulse test, t ≤ 300 μ s, duty cycle, d ≤ 2%.
TO-263 (IXTA) Outline
Dim.
Millimeter
Min. Max.
Inches
Min. Max.
A
b
b2
c
c2
4.06
0.51
1.14
0.40
1.14
4.83
0.99
1.40
0.74
1.40
.160
.020
.045
.016
.045
.190
.039
.055
.029
.055
1.
2.
3.
4.
Gate
Drain
Source
Drain
D
D1
E
E1
e
L
L1
L2
8.64
8.00
9.65
6.22
2.54
14.61
2.29
1.02
9.65
8.89
10.41
8.13
BSC
15.88
2.79
1.40
.340
.280
.380
.270
.100
.575
.090
.040
.380
.320
.405
.320
BSC
.625
.110
.055
Pins:
1 - Gate
3 - Source
2 - Drain
4 - Drain
L3
1.27
1.78
.050
.070
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
4,931,844
5,049,961
5,237,481
6,162,665
6,404,065 B1
6,683,344 6,727,585 7,005,734 B2
7,157,338B2
by one or more of the following U.S. patents: 4,850,072
5,017,508
5,063,307
5,381,025
6,259,123 B1
6,534,343
6,710,405 B2 6,759,692 7,063,975 B2
4,881,106
5,034,796
5,187,117
5,486,715
6,306,728 B1
6,583,505
6,710,463
6,771,478 B2 7,071,537
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