参数资料
型号: KIT33701DWBEVB
厂商: Freescale Semiconductor
文件页数: 6/39页
文件大小: 0K
描述: KIT FOR 33701 POWER SUPPLY
标准包装: 1
主要目的: DC/DC,LDO 步降
输出及类型: 2,非隔离
输入电压: 2.8 ~ 6V
稳压器拓扑结构: 降压
频率 - 开关: 300kHz
板类型: 完全填充
已供物品: 板,软件
已用 IC / 零件: MC34701
相关产品: MC34701EKR2CT-ND - IC POWER SUPPLY MCU 1A 32-SOIC
MC34701EKR2TR-ND - IC POWER SUPPLY MCU 1A 32-SOIC
MC34701EK-ND - IC POWER SUPPLY MCU 1A 32-SOIC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Peak Package Reflow Temperature During Reflow ,
Junction to Ambient (Single Layer) ,
Storage Temperature
Maximum Junction Temperature
Thermal Resistance
Junction to Ambient (Four Layers) (4) , (5)
Thermal Resistance, Junction to Base (6)
Operational Package Temperature (Ambient Temperature)
T STG
T PPRT
T JMAX
R ? JA
R ? JB
T A
-65 to 150
125
70
55
18
-40 to 85
? C
°C
? C
? C/W
? C/W
°C
Notes
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
5. Per JEDEC JESD51-6 with the board horizontal
6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
34701
Analog Integrated Circuit Device Data ?
6
Freescale Semiconductor
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