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| 型号： | KIT33702DWBEVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/39页 |
| 文件大小： | 0K |
| 描述： | KIT FEATURES THE MC34701 |
| 标准包装： | 1 |
| 主要目的： | DC/DC，LDO 步降 |
| 输出及类型： | 2，非隔离 |
| 输入电压： | 2.8 ~ 6V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 300kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板，软件 |
| 已用 IC / 零件： | MC34702 |
| 相关产品： | MC34702EKR2CT-ND - IC POWER SUPPLY MCU 3A 32-SOIC MC34702EKR2TR-ND - IC POWER SUPPLY MCU 3A 32-SOIC MC34702EK-ND - IC POWER SUPPLY MCU 3A 32-SOIC |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Peak Package Reflow Temperature During Reflow ,
Junction to Ambient (Single Layer) ,
Storage Temperature
Maximum Junction Temperature
Thermal Resistance
Junction to Ambient (Four Layers) (4) , (5)
Thermal Resistance, Junction to Base (6)
Operational Package Temperature (Ambient Temperature)
T STG
T PPRT
T JMAX
R ? JA
R ? JB
T A
-65 to 150
125
70
55
18
-40 to 85
? C
°C
? C
? C/W
? C/W
°C
Notes
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics..
4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
5. Per JEDEC JESD51-6 with the board horizontal
6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
34702
Analog Integrated Circuit Device Data ?
6
Freescale Semiconductor
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