参数资料
型号: KIT33880DWBEVB
厂商: Freescale Semiconductor
文件页数: 5/25页
文件大小: 0K
描述: KIT EVAL FOR MC33880 8X SW W/SPI
标准包装: 1
主要目的: 电源管理,高端和低端驱动器(内部 FET)
嵌入式:
已用 IC / 零件: MC33880
主要属性: 8 个可配置高/低 FET,5.5 ~ 24.5V,0.8 ~ 2A,0.55 欧
次要属性: SPI 接口,反向电池,温度,短路,电流限制保护
已供物品: 板,软件
产品目录页面: 808 (CN2011-ZH PDF)
相关产品: MC33880DWBR2CT-ND - IC SERIAL SWITCH OCT WSPI 32SOIC
MC33880DWR2-ND - IC SERIAL SWITCH OCT WSPI 28SOIC
MC33880DWBR2TR-ND - IC SERIAL SWITCH OCT WSPI 32SOIC
MC33880DW-ND - IC SERIAL SWITCH OCT WSPI 28SOIC
MC33880DWB-ND - IC SWITCH 8X WITH SPI 32-SOIC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VDD Supply Voltage
V DD
-0.3 to 7.0
V DC
CS, DI, DO, SCLK, IN5, IN6, and EN (1)
VPWR Supply Voltage (1)
Drain 1 – 8 (2)
5.0 mA ≤ I OUT ≤ 0.3 A
Source 1 – 8 (3)
5.0 mA ≤ I OUT ≤ 0.3 A
Output Voltage Clamp Low-Side Drive (4)
Output Voltage Clamp High-Side Drive (4)
Output Clamp Energy (5)
ESD Voltage (6)
Human Body Model
Machine Model
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Maximum Junction Temperature
V PWR
V OC
V OC
E CLAMP
V ESD1
V ESD2
T STG
T C
T J
-0.3 to 7.0
-16 to 50
-18 to 40
-28 to 40
40 to 55
-15 to -25
50
±2000
±200
-55 to 150
-40 to 125
-40 to 150
-40 to 150
V DC
V DC
V DC
V DC
V DC
V DC
mJ
V
° C
° C
° C
° C
Power Dissipation (T A = 25 ° C)
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
P D
1.3
1.7
W
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
Peak Package Reflow Temperature During Reflow (8) , (9)
R θ JA
R θ JA
R θ JL
T PPRT
94
70
18
° C/W
° C/W
°C
Notes
1.
2.
3.
4.
5.
6.
7.
8.
9.
Exceeding these limits may cause malfunction or permanent damage to the device.
Configured as low-side driver with 300 mA load as current limit.
Configured as high-side driver with 300 mA load as current limit.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
Maximum output clamp energy capability at 150 ° C junction temperature using single non-repetitive pulse method.
ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 Ω ), and ESD2 testing is performed
in accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 Ω ).
Maximum power dissipation with no heatsink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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