参数资料
型号: KMPC8343VRAGD
厂商: Freescale Semiconductor
文件页数: 71/80页
文件大小: 0K
描述: IC MPU PWRQUICC II 620-PBGA
标准包装: 2
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 620-BBGA 裸露焊盘
供应商设备封装: 620-PBGA(29x29)
包装: 托盘
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
73
System Design Information
RθJC = junction-to-case thermal resistance (°C/W)
PD = power dissipation (W)
21 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8343EA.
21.1
System Clocking
The MPC8343EA includes two PLLs:
1. The platform PLL generates the platform clock from the externally supplied CLKIN input. The
frequency ratio between the platform and CLKIN is selected using the platform PLL ratio
configuration bits as described in Section 19.1, “System PLL Configuration.”
2. The e300 core PLL generates the core clock as a slave to the platform clock. The frequency ratio
between the e300 core clock and the platform clock is selected using the e300 PLL ratio
configuration bits as described in Section 19.2, “Core PLL Configuration.”
21.2
PLL Power Supply Filtering
Each PLL gets power through independent power supply pins (AVDD1, AVDD2, respectively). The AVDD
level should always equal to VDD, and preferably these voltages are derived directly from VDD through a
low frequency filter scheme.
There are a number of ways to provide power reliably to the PLLs, but the recommended solution is to
provide four independent filter circuits as illustrated in Figure 38, one to each of the four AVDD pins.
Independent filters to each PLL reduce the opportunity to cause noise injection from one PLL to the other.
The circuit filters noise in the PLL resonant frequency range from 500 kHz to 10 MHz. It should be built
with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the
recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic
(Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value
capacitor.
To minimize noise coupled from nearby circuits, each circuit should be placed as closely as possible to the
specific AVDD pin being supplied. It should be possible to route directly from the capacitors to the AVDD
pin, which is on the periphery of package, without the inductance of vias.
Figure 38 shows the PLL power supply filter circuit.
Figure 38. PLL Power Supply Filter Circuit
VDD
AVDD (or L2AVDD)
2.2 F
GND
Low ESL Surface Mount Capacitors
10
Ω
相关PDF资料
PDF描述
IDT7024S55G IC SRAM 64KBIT 55NS 84PGA
IDT7024S35G IC SRAM 64KBIT 35NS 84PGA
IDT7024S25G IC SRAM 64KBIT 25NS 84PGA
IDT7024S20G IC SRAM 64KBIT 20NS 84PGA
IDT7024S17G IC SRAM 64KBIT 17NS 84PGA
相关代理商/技术参数
参数描述
KMPC8343VRAGDB 功能描述:微处理器 - MPU 8347 PBGA NOPB W/O ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8343ZQAGD 功能描述:IC MPU PWRQUICC II 620-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC83xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA(25x25) 包装:托盘
KMPC8343ZQAGDB 功能描述:微处理器 - MPU 8347 PBGA PB W/O ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8347CVRAGDB 功能描述:微处理器 - MPU 8347 PBGA NOPB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8347CVVAJDB 功能描述:微处理器 - MPU 8349 TBGA NOPB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324