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| 型号： | KMPC875VR133 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 8/84页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 133MHZ 256PBGA |
| 标准包装： | 2 |
| 系列： | MPC8xx |
| 处理器类型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 133MHz |
| 电压： | 3.3V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 256-BGA |
| 供应商设备封装： | 256-PBGA（23x23） |
| 包装： | 托盘 |
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MPC875/MPC870 PowerQUICC Hardware Specifications, Rev. 4
16
Freescale Semiconductor
Layout Practices
10 Layout Practices
Each VDD pin on the MPC875/MPC870 should be provided with a low-impedance path to the board’s
supply. Each GND pin should likewise be provided with a low-impedance path to ground. The power
supply pins drive distinct groups of logic on chip. The V
DD power supply should be bypassed to ground
using at least four 0.1-F bypass capacitors located as close as possible to the four sides of the package.
Each board designed should be characterized and additional appropriate decoupling capacitors should be
used if required. The capacitor leads and associated printed-circuit traces connecting to chip VDD and
GND should be kept to less than half an inch per capacitor lead. At a minimum, a four-layer board
employing two inner layers as VDD and GND planes should be used.
All output pins on the MPC875/MPC870 have fast rise and fall times. Printed circuit (PC) trace
interconnection length should be minimized in order to minimize undershoot and reflections caused by
these fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of 6 inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VDD and GND circuits. Pull up all unused inputs or signals that will be
inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins. For
more information, refer to Section 14.4.3, “Clock Synthesizer Power (VDDSYN, VSSSYN, VSSSYN1),” in
the MPC885 PowerQUICC Family Reference Manual.
PADIR (Port A data direction register)
PADIR[5:9]
PADIR[12:13]
0
PBPAR (Port B pin assignment register)
PBPAR[14:18]
PBPAR[20:22]
0
PBDIR (Port B data direction register)
PBDIR[14:8]
PBDIR[20:22]
0
PCPAR (Port C pin assignment register)
PCPAR[4:5]
PCPAR[8:9]
PCPAR[14]
0
PCDIR (Port C data direction register)
PCDIR[4:5]
PCDIR[8:9]
PCDIR[14]
0
PDPAR (Port D pin assignment register)
PDPAR[3:7]
PDPAR[9:5]
0
PDDIR (Port D data direction register)
PDDIR[3:7]
PDDIR[9:15]
0
Table 7. Mandatory Reset Configuration of MPC875/MPC870 (continued)
Register/Configuration
Field
Value
(Binary)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| KMPC875VR66 | 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KMPC875VR80 | 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KMPC875ZT133 | 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KMPC875ZT66 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Hardware Specifications |
| KMPC875ZT80 | 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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