参数资料
型号: L6230QTR
厂商: STMICROELECTRONICS
元件分类: 运动控制电子
英文描述: BRUSHLESS DC MOTOR CONTROLLER, 2.8 A, QCC32
封装: 5 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VFQFP-32
文件页数: 10/24页
文件大小: 577K
代理商: L6230QTR
Application information
L6230
18/24
Doc ID 18094 Rev 2
Figure 16.
Six-step with zero crossing detection typical application
6.4
Thermal management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be delivered by the device in a safe operating condition. Therefore, it has to
be taken into account very carefully. Besides the available space on the PCB, the right
package should be chosen considering the power dissipation. Heat sinking can be achieved
using copper on the PCB with proper area and thickness.
For instance, using a VFQFPN32L 5 x 5 package the typical Rth(JA) is about 42 °C/W when
mounted on a double-layer FR4 PCB with a dissipating copper area of 0.5 cm2 on the top
side plus 6 cm2 ground layer connected through 18 via holes (9 below the IC).
Otherwise, using a PowerSO package with copper slug soldered on a 1.5 mm copper
thickness FR4 board with 6cm2 dissipating footprint (copper thickness of 35 m), the Rth(jA)
is about 35°C/W.
Using a multi-layer board with vias to a ground plane, thermal impedance can be reduced
down to 15°C/W.
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