参数资料
型号: L6382D
厂商: STMICROELECTRONICS
元件分类: 电源管理
英文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20
封装: ROHS COMPLIANT, SOP-20
文件页数: 17/22页
文件大小: 301K
代理商: L6382D
Pin settings
L6382D
4/22
2
Pin settings
2.1
Pin connection
Figure 3.
Pin connection (top view)
2.2
Pin description
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PFI
LSI
HSI
HEI
PFG
N.C.
TPR
GND
LSG
VCC
VREF
CSI
CSO
HEG
N.C.
HVSU
N.C.
OUT
HSG
BOOT
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PFI
LSI
HSI
HEI
PFG
N.C.
TPR
GND
LSG
VCC
VREF
CSI
CSO
HEG
N.C.
HVSU
N.C.
OUT
HSG
BOOT
Table 1. Pin description
Name
Pin N°
Description
1PFI
Digital input signal to control the PFC gate driver. This pin has to be connected
to a TTL compatible signal.
2LSI
Digital input signal to control the half-bridge low side driver. This pin has to be
connected to a TTL compatible signal.
3HSI
Digital input signal to control the half-bridge high side driver. This pin has to be
connected to a TTL compatible signal.
4HEI
Digital input signal to control the HEG output. This pin has to be connected to a
TTL compatible signal.
5PFG
PFC Driver Output. This pin is intended to be connected to the PFC power
MOSFET gate. A resistor connected between this pin and the power MOS gate
can be used to reduce the peak current. An internal 10K
resistor toward
ground avoids spurious and undesired MOSFET turn-on. The totem pole
output stage is able to drive the power MOS with a peak current of 120mA
source and 250mA sink.
6
N.C.
Not connected
7TPR
Input for two point regulator; by coupling the pin with a capacitor to a switching
circuit, it is possible to implement a charge circuit for the Vcc.
8GND
Chip ground. Current return for both the low-side gate-drive currents and the
bias current of the IC. All of the ground connections of the bias components
should be tied to a trace going to this pin and kept separate from any pulsed
current return.
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