参数资料
型号: LA4425PV-MPB-H
厂商: ON Semiconductor
文件页数: 3/8页
文件大小: 0K
描述: IC AUDIO POWER AMP 5W 44SSOP
标准包装: 30
类型: AB 类
输出类型: 1-通道(单声道)
在某负载时最大输出功率 x 通道数量: 6W x 1 @ 4 欧姆
电源电压: 5 V ~ 16 V
特点: 消除爆音,过压保护,短路保护,热保护
安装类型: *
供应商设备封装: *
封装/外壳: *
包装: *
LA4425PV
No.A2011-3/8
Board specifications of the Pdmax - Ta measurement
(LA4425PV specified PCB)
Size: 70mm
× 70mm × 1.6mm3 (Four layer boards)
Copper foil thickness: L1/L4=18m, L2/L3=35m
Materials: FR-4 (Glass cloth matrix epoxy resin)
L1: Figure of copper wiring pattern
L2: Figure of copper wiring pattern
L3: Figure of copper wiring pattern
L4: Figure of copper wiring pattern
Notes:
The data for the case with the exposed die-pad substrate mounted shows the values when 95% or more of the Exposed
Die-Pad is wet.
1.
For the set design, employ the derating design with sufficient margin.
2.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such
as vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below:
(1) Maximum value 80% or less for the voltage ratings
(2) Maximum value 80% or less for the current ratings
(3) Maximum value 80% or less for the temperature ratings
3.
After the set has been designed, be sure to verify the design with the actual product. Confirm the solder joint state
and verify also the reliability of solder joint for the Exposed Die-Pad, etc. Any void or deterioration, if observed in
the solder joint of these parts, causes deteriorated thermal conduction, possibly resulting in thermal destruction of
IC.
-40
-20
0
20
40
60
80
100
0
6.0
1.0
2.0
3.0
4.0
5.0
Pd max -- Ta
5.15
2.68
Ambient temperature, Ta -- C
Maximum
power
dissipation,
Pd
max
-
W
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