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| 型号： | LC4256B-10F256AI |
| 厂商： | LATTICE SEMICONDUCTOR CORP |
| 元件分类： | PLD |
| 中文描述： | EE PLD, 10 ns, PBGA256 |
| 封装： | FPBGA-256 |
| 文件页数： | 4/99页 |
| 文件大小： | 760K |
| 代理商： | LC4256B-10F256AI |
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Lattice Semiconductor
ispMACH 4000V/B/C/Z Family Data Sheet
12
LVTTL
LVCMOS 1.8
LVCMOS 3.3
3.3V PCI Compatible
LVCMOS 2.5
All of the I/Os and dedicated inputs have the capability to provide a bus-keeper latch, Pull-up Resistor or Pull-down
Resistor. A fourth option is to provide none of these. The selection is done on a global basis. The default in both
hardware and software is such that when the device is erased or if the user does not specify, the input structure is
configured to be a Pull-up Resistor.
Each ispMACH 4000 device I/O has an individually programmable output slew rate control bit. Each output can be
individually configured for fast slew or slow slew. The typical edge rate difference between fast and slow slew set-
ting is 20%. For high-speed designs with long, unterminated traces, the slow-slew rate will introduce fewer reflec-
tions, less noise and keep ground bounce to a minimum. For designs with short traces or well terminated lines, the
fast slew rate can be used to achieve the highest speed.
Global OE Generation
Most ispMACH 4000 family devices have a 4-bit wide Global OE Bus, except the ispMACH 4032 device that has a
2-bit wide Global OE Bus. This bus is derived from a 4-bit internal global OE PT bus and two dual purpose I/O or
GOE pins. Each signal that drives the bus can optionally be inverted.
Each GLB has a block-level OE PT that connects to all bits of the Global OE PT bus with four fuses. Hence, for a
256-macrocell device (with 16 blocks), each line of the bus is driven from 16 OE product terms. Figures 9 and 10
show a graphical representation of the global OE generation.
Figure 9. Global OE Generation for All Devices Except ispMACH 4032
Shared PTOE
(Block 0)
Shared PTOE
(Block n)
Global
Fuses
GOE (0:3)
to I/O cells
Internal Global OE
PT Bus
(4 lines)
4-Bit
Global OE Bus
Global OE
Fuse connection
Hard wired
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相关代理商/技术参数 |
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| LC4256B-10F256AI1 | 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:3.3V/2.5V/1.8V In-System Programmable SuperFAST High Density PLDs |
| LC4256B-10F256BI | 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAMMABLE SUPER FAST HI DENSITY PLD RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100 |
| LC4256B-10F256BI1 | 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:3.3V/2.5V/1.8V In-System Programmable SuperFAST High Density PLDs |
| LC4256B-10FN256AI | 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAMMABLE SUPER FAST HI DENSITY PLD RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100 |
| LC4256B-10FN256AI1 | 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:3.3V/2.5V/1.8V In-System Programmable SuperFAST High Density PLDs |
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