收藏本站
参数资料
型号： LC5512MV-75FN256I
厂商： Lattice Semiconductor Corporation
文件页数： 51/99页
文件大小： 0K
描述： IC CPLD 512MACROCELLS 256FPBGA
标准包装： 90
系列： ispXPLD® 5000MV
可编程类型： 系统内可编程
最大延迟时间 tpd(1)： 7.5ns
电压电源 - 内部： 3 V ~ 3.6 V
逻辑元件/逻辑块数目： 16
宏单元数： 512
输入/输出数： 193
工作温度： -40°C ~ 105°C
安装类型： 表面贴装
封装/外壳： 256-BGA
供应商设备封装： 256-FPBGA（17x17）
包装： 托盘
Lattice Semiconductor
ispXPLD 5000MX Family Data Sheet
51
Signals
208 PQFP
4
256 fpBGA
3, 5
484 fpBGA, 5
3
672 fpBGA
3, 5
VCC
10, 49, 76, 114,
153, 180
D4, D13, F6, F11, L6,
L11, N4, N13
A17, A6, AA2, AA21, AB17,
AB6, B2, B21, D19, D4, F1,
F22, G10, G11, G12, G13, K16,
K7, L16, L7, M16, M7, T10,
T11, T12, T13, T14, T9, U1,
U22, W19, W4
AA21, AA6, F21, F6, G20, G7, J13,
J14, K13, K14, L13, L14, M13, M14,
N10, N11, N12, N15, N16, N17, N18,
N9, P10, P11, P12, P15, P16, P17,
P18, P9, R13, R14, T13, T14, U13,
U14, V13, V14, Y20, Y7
VCCO0
5, 17, 189, 204 A1, F7, G6
B9, C3, G8, G9, H7, J2, J7, P4
H10, H11, H8, H9, J8, J9, K8, L8, M8,
N8
VCCO1
42, 57, 72
K6, L7, T1
AA9, R7, T3, T8, Y3
P8, R8, T8, U8, V8, V9, W10, W11,
W8, W9
VCCO2
85, 100, 107,
121
K11, L10, T16
AA14, R16, T15, T20, Y20
P19, R19, T19, U19, V18, V19, W12,
W13, W14, W15, W16, W17, W18,
W19
VCCO3
146, 161, 176
A16, F10, G11
B14, C20, G14, G15, H16, J16,
J21, P19
H12, H13, H14, H15, H16, H17, H18,
H19, J18, J19, K19, L19, M19, N19
VCCP
136
J16
M22
N25
VCCJ
27
J1
M1
N4
GND
15, 29, 44, 81,
119, 148, 185,
7, 19, 191, 205,
40, 56, 70, 87,
101, 109, 123,
144, 160, 174
K1, C3, C14, E5, E12,
G7, G8, G9, G10, H7,
H8, H9, H10, J7, J8, J9,
J10, K7, K8, K9, K10,
M5, M12, P3
N1, A1, A2, A21, A22, AA1,
AA22, AB1, AB22, B1, B22,
C15, C8, D11, D12, E18, E5,
F17, F6, G16, G7, H10, H11,
H12, H13, H14, H15, H20, H3,
H8, H9, J10, J11, J12, J13, J14,
J15, J8, J9, K10, K11, K12,
K13, K14, K15, K8, K9, L10,
L11, L12, L13, L14, L15, L19,
L4, L8, L9, M10, M11, M12,
M13, M14, M19, M4, M9, N10,
N11, N12, N13, N14, N9, P10,
P11, P12, P13, P14, P9, R10,
R11, R12, R13, R14, R15, R8,
R9, T16, T7, W11, W12, Y15,
Y8
A11, A16, A2, A25, AE1, AE2, AE25,
AE26, AF11, AF16, AF2, AF25, B1,
B2, B25, B26, J10, J11, J12, J15, J16,
J17, K10, K11, K12, K15, K16, K17,
K18, K9, L1, L10, L11, L12, L15, L16,
L17, L18, L26, L9, M10, M11, M12,
M15, M16, M17, M18, M9, N13, N14,
P13, P14, R10, R11, R12, R15, R16,
R17, R18, R9, T1, T10, T11, T12,
T15, T16, T17, T18, T26, T9, U10,
U11, U12, U15, U16, U17, U18, U9,
V10, V11, V12, V15, V16, V17
GNDP
134
K16
N22
P26
NC
2
—
5256MX: A2, A11, A12,
A15, B2, B12, B15,
B16, C4, C12, C15,
C16, D1, D11, D14,
D15, D16, E1, E4, E10,
E11, E13, E14, F4, F5,
F12, F13, L1, L4, M3,
M7, M13, N2, N6, P1,
P2, P5, P6, P13, P14,
P15, P16, R1, R2, R4,
R5, R6, R16, T2, T3,
T4, T5, T6
5512MX/5768MX: L1
5512MX: P1, AA19, AB2, AB21,
J17, J6, K1, K17, K18, K19, K2,
K20, K21, K22, K3, K4, K5, K6,
L1, L17, L18, L2, L20, L21, L22,
L3, L5, L6, M15, M17, M18, M2,
M20, M21, M3, M5, M6, M8,
N15, N17, N18, N19, N2, N20,
N21, N3, N4, N5, N6, N8, P15,
P17, P18, P2, P21, P22, P5,
P6, P8, U17, U6, V18, V5, W6
5768MX/51024MX: None
A12, A13, A14, A15, AA10, AA11,
AA12, AA13, AA14, AA15, AA16,
AA17, AA7, AB10, AB11, AB12,
AB13, AB14, AB15, AB16, AB17,
AC10, AC11, AC12, AC13, AC14,
AC15, AC16, AC17, AD11, AD12,
AD13, AD14, AD15, AD16, AE11,
AE12, AE13, AE14, AE15, AE16,
AF12, AF13, AF14, AF15, B11, B12,
B13, B14, B15, B16, C11, C12, C13,
C14, C15, C16, C3, D10, D11, D12,
D13, D14, D15, D16, D17, E10, E11,
E12, E13, E14, E15, E16, E17, E6,
E7, E8, F10, F11, F12, F13, F14, F15,
F16, F17, G10, G11, G12, G13, G14,
G15, G16, G17, Y10, Y11, Y12, Y13,
Y14, Y15, Y16, Y17
1. All grounds must be electrically connected at the board level.
2. NC pins should not be connected to any active signals, VCC or GND.
3. Balls for GND, VCC and VCCOX are connected within the substrate to their respective common signals. Pin orientation A1 starts from the
upper left corner of the top side view with alphabetical order ascending vertically and numerical order ascending horizontally.
4. Pin orientation follows the conventional counter-clockwise order from pin 1 marking of the topside view.
5. Internal GNDs and I/O GNDs (Bank 0 - Bank 3)are connected inside package. VCCO balls connect to four power planes within the pack-
age, one each for VCCOX.
SELECT
DEVICES
DISCONTINUED
相关PDF资料
PDF描述
70F333AI-RC CHOKE RF VARNISHED 3300UH 5%
GRM31CC80J476ME18L CAP CER 47UF 6.3V 20% X6S 1206
172-015-102R001 CONN DB15 MALE SOLDER CUP TIN
LC5512MV-45FN256C IC CPLD 512MACROCELLS 256FPBGA
MIC39151-2.5BU IC REG LDO 2.5V 1.5A TO263-5
相关代理商/技术参数
参数描述
LC5512MV-75FN484C 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5512MV-75FN484I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5512MV-75FN672C 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD⑩ Family
LC5512MV-75FN672I 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD⑩ Family
LC5512MV-75Q208C 功能描述:CPLD - 复杂可编程逻辑器件 3.3V 149 I/O RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*