参数资料
型号: LM2735SD3.3EVAL
厂商: National Semiconductor
文件页数: 17/58页
文件大小: 0K
描述: BOARD EVALUATION FOR LM2735
标准包装: 1
主要目的: DC/DC,步升
输出及类型: 1,非隔离
输出电压: 3.3V
电流 - 输出: 500mA
输入电压: 3 ~ 5.5 V
稳压器拓扑结构: 升压
频率 - 开关: 1.6MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: LM2735
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LM2735XMYX-ND - IC REG BST SEPIC ADJ 2.1A 8EMSOP
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LM2735YMYDKR-ND - IC REG BST SEPIC ADJ 2.1A 8EMSOP
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SNVS485F – JUNE 2007 – REVISED APRIL 2013
Definitions
Heat energy is transferred from regions of high temperature to regions of low temperature via three basic
mechanisms: radiation, conduction and convection.
Radiation Electromagnetic transfer of heat between masses at different temperatures.
Conduction Transfer of heat through a solid medium.
Convection Transfer of heat through the medium of a fluid; typically air.
Conduction & Convection will be the dominant heat transfer mechanism in most applications.
R θ JC Thermal impedance from silicon junction to device case temperature.
R θ JA Thermal impedance from silicon junction to ambient air temperature.
C θ JC Thermal Delay from silicon junction to device case temperature.
C θ CA Thermal Delay from device case to ambient air temperature.
R θ JA & R θ JC These two symbols represent thermal impedances, and most data sheets contain associated values
for these two symbols. The units of measurement are °C/Watt.
R θ JA is the sum of smaller thermal impedances (see Figure 27 ). The capacitors represent delays that are present
from the time that power and its associated heat is increased or decreased from steady state in one medium until
the time that the heat increase or decrease reaches steady state on the another medium.
R T C - A
C T C - A
T C
R T J- CASE
C T J- CASE
T A
T J
Internal - P DISS
Figure 27. Simplified Thermal Impedance Model
The datasheet values for these symbols are given so that one might compare the thermal performance of one
package against another. In order to achieve a comparison between packages, all other variables must be held
constant in the comparison (PCB size, copper weight, thermal vias, power dissipation, V IN , V OUT , Load Current
etc). This does shed light on the package performance, but it would be a mistake to use these values to calculate
the actual junction temperature in your application.
R T JA =
T J - T A
P Dissipatio n
(17)
We will talk more about calculating the variables of this equation later, and how to eventually calculate a proper
junction temperature with relative certainty. For now we need to define the process of calculating the junction
temperature and clarify some common misconceptions.
R θ JA [Variables]:
?
?
?
?
Input Voltage, Output Voltage, Output Current, RDSon.
Ambient temperature & air flow.
Internal & External components power dissipation.
Package thermal limitations.
Copyright ? 2007–2013, Texas Instruments Incorporated
Product Folder Links: LM2735
17
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