参数资料
型号: LM2735SD3.3EVAL
厂商: National Semiconductor
文件页数: 18/58页
文件大小: 0K
描述: BOARD EVALUATION FOR LM2735
标准包装: 1
主要目的: DC/DC,步升
输出及类型: 1,非隔离
输出电压: 3.3V
电流 - 输出: 500mA
输入电压: 3 ~ 5.5 V
稳压器拓扑结构: 升压
频率 - 开关: 1.6MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: LM2735
相关产品: LM2735YSDX-ND - IC REG BOOST SEPIC ADJ 2.1A 6LLP
LM2735YMYX-ND - IC REG BST SEPIC ADJ 2.1A 8EMSOP
LM2735YMFX-ND - IC REG BOOST SEPIC ADJ SOT23-5
LM2735XSDX-ND - IC REG BOOST SEPIC ADJ 2.1A 6LLP
LM2735XMYX-ND - IC REG BST SEPIC ADJ 2.1A 8EMSOP
LM2735XMFX-ND - IC REG BOOST SEPIC ADJ SOT23-5
LM2735YSDDKR-ND - IC REG BOOST SEPIC ADJ 2.1A 6LLP
LM2735YMYDKR-ND - IC REG BST SEPIC ADJ 2.1A 8EMSOP
LM2735YMFDKR-ND - IC REG BOOST SEPIC ADJ SOT23-5
LM2735XSDDKR-ND - IC REG BOOST SEPIC ADJ 2.1A 6LLP
更多...
SNVS485F – JUNE 2007 – REVISED APRIL 2013
?
PCB variables (copper weight, thermal via’s, layers component placement).
It would be wrong to assume that the top case temperature is the proper temperature when calculating R θ JC
value. The R θ JC value represents the thermal impedance of all six sides of a package, not just the top side. This
document will refer to a thermal impedance called R ψ JC . R ψ JC represents a thermal impedance associated with
just the top case temperature. This will allow one to calculate the junction temperature with a thermal sensor
connected to the top case.
LM2735 Thermal Models
Heat is dissipated from the LM2735 and other devices. The external loss elements include the Schottky diode,
inductor, and loads. All loss elements will mutually increase the heat on the PCB, and therefore increase each
other’s temperatures.
L 1
I L t ( )
D 1
V OUT ( t )
V IN
Q 1
C 1
Figure 28. Thermal Schematic
18
Product Folder Links: LM2735
Copyright ? 2007–2013, Texas Instruments Incorporated
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