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| 型号： | LM75AD,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 20/24页 |
| 文件大小： | 137K |
| 描述： | IC TEMP SENSOR DIGITAL 8-SOIC |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 100 |
| 功能： | 温度监视系统（传感器），监视器 |
| 传感器类型： | 内部 |
| 感应温度： | -55°C ~ 125°C |
| 精确度： | ±3°C（最小值） |
| 拓扑： | ADC（三角积分型），比较器，振荡器，寄存器库 |
| 输出类型： | 2 线串行，I²C? |
| 输出警报： | 无 |
| 输出风扇： | 是 |
| 电源电压： | 2.8 V ~ 5.5 V |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
| 产品目录页面： | 846 (CN2011-ZH PDF) |
| 配用： | 568-4002-ND - DEMO BOARD I2C |
| 其它名称： | 568-4226-5 935269775112 LM75AD LM75AD-ND |
LM75A_4
?NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 10 July 2007
20 of 24
NXP Semiconductors
LM75A
Digital temperature sensor and thermal watchdog
14.4 Reow soldering
Key characteristics in reow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see
Figure
15) than a PbSn process, thus
reducing the process window
" Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
" Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
T
ab
le
19 and
20
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see
Figure
15.
Table 19. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
e 350
< 2.5
235
220
e 2.5
220
220
Table 20. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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相关代理商/技术参数 |
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| LM75ADP | 制造商:NXP Semiconductors 功能描述:Digital Temp Sensor 2-Wire,LM75ADP |
| LM75ADP,118 | 功能描述:板上安装温度传感器 TEMP SENSOR DIGITAL RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| LM75ADP,118 | 制造商:NXP Semiconductors 功能描述:IC, TEMP SENSOR, 0.125C, 3C, TSSOP-8 |
| LM75ADP,118-CUT TAPE | 制造商:NXP 功能描述:LM75A Series SMD 5.5 mA Digital Temperature Sensor w/ Thermal Watchdog TSSOP-8 |
| LM75ADP/DG,118 | 功能描述:板上安装温度传感器 DIGITAL TEMP SENSOR AND THERMAL WATCHDOG RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
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