参数资料
| 型号： | LNK354P |
| 厂商： | Power Integrations |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC OFFLINE SWIT OCP HV 8DIP |
| 标准包装： | 3,000 |
| 系列： | LinkSwitch®-HF |
| 输出隔离： | 隔离 |
| 频率范围： | 186kHz ~ 214kHz |
| 输出电压： | 700V |
| 功率（瓦特）： | 5W |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm），7 引线 |
| 供应商设备封装： | DIP-8B |
| 包装： | 管件 |
LNK353/354
DIP-8B
-E-
.240 (6.10)
.260 (6.60)
Pin 1
-D-
.125 (3.18)
.145 (3.68)
⊕ D S .004 (.10)
.367 (9.32)
.387 (9.83)
.137 (3.48)
MINIMUM
.057 (1.45)
.068 (1.73)
(NOTE 6)
.015 (.38)
MINIMUM
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
-T-
SEATING
PLANE
.120 (3.05)
.140 (3.56)
.008 (.20)
.015 (.38)
.014 (.36)
.100 (2.54) BSC
.048 (1.22)
.053 (1.35)
.022 (.56) ⊕ T E D S .010 (.25) M
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
P08B
PI-2551-121504
SMD-8B
-E-
⊕ D S .004 (.10)
.137 (3.48)
MINIMUM
Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
.240 (6.10)
.260 (6.60)
.372 (9.45)
.388 (9.86)
⊕ E S .010 (.25)
.046 .060
.060 .046
.420
protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1,
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
Pin 1
Pin 1
.080
4. Minimum metal to metal
spacing at the package body
for the omitted lead location
-D-
.100 (2.54) (BSC)
.367 (9.32)
.387 (9.83)
.057 (1.45)
.086
.186
.286
Solder Pad Dimensions
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
6. D and E are referenced
datums on the package
body.
.125 (3.18)
.145 (3.68)
.068 (1.73)
(NOTE 5)
.032 (.81)
.037 (.94)
.048 (1.22)
.053 (1.35)
.009 (.23)
.004 (.10)
.012 (.30)
.004 (.10)
.036 (0.91)
.044 (1.12)
0 ° - 8 °
G08B
PI-2546-121504
F
2/05
13
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