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| 型号： | LP3906SQXVPFP |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 稳压器 |
| 英文描述： | 2 A DUAL SWITCHING CONTROLLER, 2000 kHz SWITCHING FREQ-MAX, QCC24 |
| 封装： | 5 X 4 MM, 0.80 MM HEIGHT, LLP-24 |
| 文件页数： | 31/40页 |
| 文件大小： | 4197K |
| 代理商： | LP3906SQXVPFP |
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Thermal Performance of the LLP
Package
The LP3906 is a monolithic device with integrated power
FETs. For that reason, it is important to pay special attention
to the thermal impedance of the LLP package and to the PCB
layout rules in order to maximize power dissipation of the LLP
package.
The LLP package is designed for enhanced thermal perfor-
mance and features an exposed die attach pad at the bottom
center of the package that creates a direct path to the PCB
for maximum power dissipation. Compared to the traditional
leaded packages where the die attach pad is embedded in-
side the molding compound, the LLP reduces one layer in the
thermal path.
The thermal advantage of the LLP package is fully realized
only when the exposed die attach pad is soldered down to a
thermal land on the PCB board with thermal vias planted un-
derneath the thermal land. Based on thermal analysis of the
LLP package, the junction-to-ambient thermal resistance
(
θJA) can be improved by a factor of two when the die attach
pad of the LLP package is soldered directly onto the PCB with
thermal land and thermal vias, as opposed to an alternative
with no direct soldering to a thermal land. Typical pitch and
outer diameter for thermal vias are 1.27mm and 0.33mm re-
spectively. Typical copper via barrel plating is 1oz, although
thicker copper may be used to further improve thermal per-
formance. The LP3906 die attach pad is connected to the
substrate of the IC and therefore, the thermal land and vias
on the PCB board need to be connected to ground (GND pin).
For more information on board layout techniques, refer to Ap-
plication Note AN–1187 “Leadless Lead frame Package
(LLP).” on http://www.national.com This application note also
discusses package handling, solder stencil and the assembly
process.
37
www.national.com
LP3906
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LP3906SQX-VPFP/NOPB | 功能描述:其他电源管理 RoHS:否 制造商:Texas Instruments 输出电压范围: 输出电流:4 mA 输入电压范围:3 V to 3.6 V 输入电流: 功率耗散: 工作温度范围:- 40 C to + 110 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-48 封装:Reel |
| LP3907 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Dual High-Current Step-Down DC/DC and Dual Linear Regulator with I2C Compatible Interface |
| LP3907QSQ-JJXP/NOPB | 功能描述:上下转换器 Dual Hi-Current SD DC/DC RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| LP3907QSQ-JXI7/NOPB | 功能描述:低压差稳压器 - LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| LP3907QSQ-JXIP/NOPB | 功能描述:上下转换器 Dual Hi-Current SD DC/DC RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
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