参数资料
型号: LP62S16128CU-70LLI
厂商: AMIC Technology Corporation
元件分类: SRAM
英文描述: 128K X 16 BIT LOW VOLTAGE CMOS SRAM
中文描述: 128K的× 16位低电压CMOS的SRAM
文件页数: 6/14页
文件大小: 160K
代理商: LP62S16128CU-70LLI
LP62S16128B-I Series
(August, 2001, Version 1.0)
14
AMIC Technology, Inc.
Package Information
48LD CSP (6 x 8 mm) Outline Dimensions
unit: mm
(48TFBGA)
A
1
A
2
A
B
C
D
E
F
G
H
TOP VIEW
Ball#A1 CORNER
SIDE VIEW
C
SEATING PLANE
//
0.25
C
A
(0.36)
A
B
C
D
E
F
G
H
1
2
3
4
5
6
1
2
3
4
5
6
C
0.10
C
S
0.25 S
A B
b (48X)
BOTTOM VIEW
Ball*A1 CORNER
E
1
e
B
e
D1
D
A
0.20(4X)
0.10
C
Dimensions in mm
Symbol
MIN.
NOM.
MAX.
A
1.04
1.14
1.24
A1
0.20
0.25
0.30
A2
0.48
0.53
0.58
D
5.90
6.00
6.10
E
7.90
8.00
8.10
D1
---
3.75
---
E1
---
5.25
---
e
---
0.75
---
b
0.30
0.35
0.40
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF
THE SOLDER BALL AND THE BODY EDGE.
4. BALL PAD OPENING OF SUBSTRATE IS
Φ 0.3mm (SMD)
SUGGEST TO DESIGN THE PCB LAND SIZE AS
Φ 0.3mm (NSMD)
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