参数资料
型号: LPC11U13FBD48/201,
厂商: NXP Semiconductors
文件页数: 61/72页
文件大小: 0K
描述: IC MCU 32BIT 24K 48LQFP
产品培训模块: Code Density for LPC11xx
标准包装: 250
系列: LPC11Uxx
核心处理器: ARM? Cortex?-M0
芯体尺寸: 32-位
速度: 50MHz
连通性: I²C,Microwire,智能卡,SPI,SSP,UART/USART,USB
外围设备: 欠压检测/复位,POR,WDT
输入/输出数: 40
程序存储器容量: 24KB(24K x 8)
程序存储器类型: 闪存
RAM 容量: 6K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 3.6 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 48-LQFP
包装: 托盘
其它名称: 568-8563
LPC11U1X
All information provided in this document is subject to legal disclaimers.
NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2.2 — 11 March 2014
64 of 72
NXP Semiconductors
LPC11U1x
32-bit ARM Cortex-M0 microcontroller
Fig 38. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
001aao134
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Remark:
Stencil thickness: 0.125 mm
e = 0.65
evia = 4.25
OwDtot = 5.10 OA
PID = 7.25 PA+OA
OID = 8.20 OA
0.20 SR
chamfer (4×)
0.45
DM
evia
=
1.05
W = 0.30 CU
evia
=
4.25
evia = 2.40
LbE
=
5.80
CU
LbD = 5.80 CU
PIE
=
7.25
P
A+OA
LaE
=
7.95
CU
LaD = 7.95 CU
OIE
=
8.20
OA
OwEtot
=
5.10
OA
EHS
=
4.85
CU
DHS = 4.85 CU
4.55
SR
4.55 SR
B-side
(A-side fully covered)
number of vias: 20
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
SEhtot
=
2.70
SP
SDhtot = 2.70 SP
GapE
=
0.70
SP
SPE
=
1.00
SP
0.45 DM
SPD = 1.00 SP
GapD = 0.70 SP
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