参数资料
型号: LSM2-T/6-W3NG-C
元件分类: 电源模块
英文描述: 1-OUTPUT 19.8 W DC-DC REG PWR SUPPLY MODULE
封装: ROHS COMPLIANT
文件页数: 2/17页
文件大小: 1394K
代理商: LSM2-T/6-W3NG-C
LSM2 Series
Single Output, Non-isolated, Selectable-Output POL DC/DC Converters
MDC_LSM2_A01 Page 0 of 7
P O W E R E L E C T R O N I C S D I V I S I O N
D C / D C C O N V E R T E R S
www.cd4power.com
Tape & Reel Surface Mount Package
DATEL's LSM2 series DC/DC converters are the only higher-current (6A) SMT
DC/DC's that can be automatically "pick-and-placed" using standard vacuum-
pickup equipment (nozzle size and style, vacuum pressure and placement
speed may need to be optimized for automated pick and place) and subse-
quently reflowed using high-temperature, lead-free solder.
Virtually all SMT DC/DC's today are unprotected "open-frame" devices as-
sembled by their vendors with high-temperature solder (usually Sn96.5/Ag3.5
with a melting point +22°C) so that you may attach them to your board using
low-temperature solder (usually Sn63/Pb37 with a melting point of +83°C).
Conceptually straightforward, this "stepped" solder approach has its limita-
tions, and it is clearly out of step with an industry trending toward the broad
use of lead-free solders. Are you to experiment and develop reflow profiles
from other vendors that ensure the components on those DC/DC never exceed
25-26°C? If those components get too hot, "double-reflow" could compro-
mise the reliability of their solder joints. Virtually all these devices demand you
"cool down" the Sn63 profile you are likely using today.
Figure 6. Reflow Solder Profile
DATEL is not exempted from the Laws of Physics, and we do not have magic
solders no one else has. Nevertheless, we have a simple and practical,
straightforward approach that works. We assemble our LSM2 SMT DC/DC's
using a high-temperature (+26°C), lead-free alloy (Sn96.2%, Ag2.5%,
Cu0.8%, Sb0.5%). The LSM2 design ensures co-planarity to within 0.004
inches (00m) of the unit's tin-plated (50 micro-inches) copper leads. See
Mechanical Data for additional information.
The disposable heat shield (patent pending), which has a cutaway exposing
the package leads, provides thermal insulation to internal components during
reflow and its smooth surface ideally doubles as the vacuum pick-up location
also. The insulation properties of the heat shield are so effective that tempera-
ture differentials as high as 50°C develop inside-to-outside the shield. Oven
temperature profiles with peaks of 250-260°C and dwell times exceeding 2
minutes above 22°C (the melting point of Sn96.5/Ag3.5) are easily achieved.
HEAT SHIELD OUTSIDE TEMPERA TURE
Sn96.5/Ag3.5 Melting P
oint
Sn63/Pb37 Meltin
g Point
250
200
150
100
50
0
50
100
150
200
250
300
350
400
221
183
PCB TEMPERA TURE INSIDETHE HEAT SHIELD
Te
m
perature
(
C)
Time (Seconds)
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