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参数资料
| 型号： | LT3009EDC-1.2#TRMPBF |
| 厂商： | Linear Technology |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.2V 20MA 6-DFN |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 500 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.2V |
| 输入电压： | 1.6 V ~ 20 V |
| 电压 - 压降（标准）： | 0.28V @ 20mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 20mA |
| 电流 - 限制（最小）： | 22mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WFDFN 裸露焊盘 |
| 供应商设备封装： | 6-DFN-EP（2x2） |
| 包装： | 带卷 (TR) |
LT3009 Series
APPLICATIONS INFORMATION
Voltage and temperature coef?cients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress,
similar to the way a piezoelectric accelerometer or micro-
phone works. For a ceramic capacitor, the stress can be
induced by vibrations in the system or thermal transients.
The resulting voltages produced can cause appreciable
amounts of noise, especially when a ceramic capacitor is
used for noise bypassing. A ceramic capacitor produced
Figure 4’s trace in response to light tapping from a pencil.
Similar vibration induced behavior can masquerade as
increased output voltage noise.
V OUT = 0.6V
C OUT = 22μF
I LOAD = 10μA
V OUT
500 μ V/DIV
Thermal Considerations
The LT3009’s maximum rated junction temperature of
125°C limits its power-handling capability. Two components
comprise the power dissipated by the device:
1. Output current multiplied by the input/output voltage
differential: I OUT ? (V IN – V OUT )
2. GND pin current multiplied by the input voltage:
I GND ? V IN
GND pin current is found by examining the GND Pin Cur-
rent curves in the Typical Performance Characteristics
section. Power dissipation equals the sum of the two
components listed prior.
The LT3009 regulator has internal thermal limiting designed
to protect the device during overload conditions. For con-
tinuous normal conditions, do not exceed the maximum
junction temperature rating of 125°C. Carefully consider
all sources of thermal resistance from junction to ambi-
ent including other heat sources mounted in proximity to
the LT3009. For surface mount devices, heat sinking is
accomplished by using the heat spreading capabilities of
100ms/DIV
3009 F04
the PC board and its copper traces. Copper board stiffeners
and plated through-holes can also be used to spread the
Figure 4. Noise Resulting from Tapping
heat generated by power devices.
on a Ceramic Capacitor
3009fd
14
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT3009EDC-2.5#PBF | 制造商:Linear Technology 功能描述:Bulk |
| LT3009EDC-2.5#TRMPBF | 功能描述:IC REG LDO 2.5V 20MA 6-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.7V 输入电压:最高 5.5V 电压 - 压降（标准）:0.21V @ 150mA 稳压器数量:1 电流 - 输出:150mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:剪切带 (CT) 产品目录页面:1100 (CN2011-ZH PDF) 其它名称:576-1852-1 |
| LT3009EDC-2.5#TRPBF | 功能描述:IC REG LDO 2.5V 20MA 6-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.7V 输入电压:最高 5.5V 电压 - 压降（标准）:0.21V @ 150mA 稳压器数量:1 电流 - 输出:150mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:剪切带 (CT) 产品目录页面:1100 (CN2011-ZH PDF) 其它名称:576-1852-1 |
| LT3009EDC-2.5-PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:3μA IQ, 20mA Low Dropout Linear Regulators |
| LT3009EDC-2.5-TRPBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:3μA IQ, 20mA Low Dropout Linear Regulators |
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