参数资料
型号: LT3505IMS8E#PBF
厂商: Linear Technology
文件页数: 23/24页
文件大小: 0K
描述: IC REG BUCK ADJ 1.2A 8MSOP
标准包装: 50
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.78 V ~ 33.8 V
输入电压: 3.6 V ~ 36 V
PWM 型: 电流模式
频率 - 开关: 200kHz ~ 3.01MHz
电流 - 输出: 1.2A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
包装: 管件
供应商设备封装: 8-MSOP-EP
LT3505
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ± 0.05
R = 0.115
TYP
5
8
0.38 ± 0.10
3.5 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
0.25 ± 0.05
0.50
BSC
2.38 ± 0.05
(2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
3.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
(DD) DFN 1203
4 1
0.25 ± 0.05
0.50 BSC
2.38 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE
OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
5.23
(.206)
MIN
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
2.083 ± 0.102 3.20 – 3.45
(.082 ± .004) (.126 – .136)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1
2.06 ± 0.102
(.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
4.90 ± 0.152
(.193 ± .006)
8
7 6 5
0.52
(.0205)
REF
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.42 ± 0.038 0.65
(.0165 ± .0015) (.0256)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
8
1
2 3
4
1.10
0.86
0.65
(.0256)
GAUGE PLANE
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
0.53 ± 0.152
(.021 ± .006)
0.18
(.007)
DETAIL “A”
SEATING
PLANE
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
BSC
(.034)
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8E) 0603
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3505fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
23
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