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参数资料
| 型号： | LTC1755EGN#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD INTERFACE 24SSOP |
| 标准包装： | 55 |
| 应用： | 智能卡 |
| 电源电压： | 2.7 V ~ 6 V |
| 封装/外壳： | 24-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 24-SSOP |
| 包装： | 管件 |
| 安装类型： | 表面贴装 |
| 产品目录页面： | 1355 (CN2011-ZH PDF) |
7
LTC1755/LTC1756
Note: If a normally closed switch is used, a small current
(several microamperes) will flow through the switch when-
ever a Smart Card is not present. For ultralow power
consumption in shutdown, a normally open switch is
optimum.
DVCC sets the logic reference level for the NC/NO pin.
GND (Pins 5/3): Ground Reference for the IC. This pin
should be connected to a low impedance ground plane.
Bypass capacitors for VIN and VCC should be in close
proximity to the GND pin.
VIN (Pins 6/4): Supply Voltage for the Charge Pump. May
be between 2.7V and 6V. A 10
F low ESR ceramic bypass
capacitor is required on this pin for optimum performance.
VCC (Pins 7/5): Regulated Smart Card Supply Voltage.
This pin should be connected to the Smart Card VCC
contact. The 5V/3V pin determines the VCC output voltage.
The VCC pin is protected against short circuits by compar-
ing the actual output voltage with an internal reference
voltage. If VCC is below its correct level (for as little as 5s)
the LTC1755/LTC1756 switch to the Alarm state (see the
State Diagram). The VCC pin requires a 10F charge
storage capacitor to ground. For optimum performance a
low ESR ceramic capacitor should be used.
During the Idle and Alarm states the VCC pin is rapidly
discharged to ground to comply with the deactivation
requirements of the EMV and ISO-7816 specifications.
AUX1 (Pin 8, LTC1755 Only): (Input/Output) Smart Card
Side Auxiliary I/O Pin. This pin is used for auxiliary
bidirectional data transfer between the microcontroller
and the Smart Card. It has the same characteristics as the
I/O pin.
AUX2 (Pin 9, LTC1755 Only): (Input/Output) Smart Card
Side Auxiliary I/O Pin. This pin is used for auxiliary
bidirectional data transfer between the microcontroller
and the Smart Card. It has the same characteristics as the
I/O pin.
I/O (Pins 10/6): (Input/Output) Smart Card Side Data I/O
Pin. This pin is used for bidirectional data transfer between
the microcontroller and the Smart Card. It should be con-
nected to the Smart Card I/O contact. The Smart Card I/O
pin must be able to sink up to 250
A when driving the I/O
pin low due to the pull-up current source. The I/O pin be-
comes a low impedance to ground during the Idle state. It
does not become active until READY goes low indicating
that VCC is stable.
Once READY is low the I/O pin is protected against short
circuits to VCC by current limiting to 5mA maximum.
The DATA-I/O channel is bidirectional for half-duplex
transmissions. Its idle state is H-H. Once an L is detected
on one side of the channel the direction of transmission is
established. Specifically, the side which received an L first
is now the input, and the opposite side is the output.
Transmission from the output side back to the input side
is inhibited, thereby preventing a latch condition. Once the
input side releases its L, both sides return to H, and the
channel is now ready for a new L to be transmitted in either
direction. If an L is forced externally on the output side, and
it persists until after the L on the input side is released, this
illegal input will not be transmitted to the input side
because the transmission direction will not have changed.
The direction of transmission can only be established from
the idle (H-H) state and is determined by the first receipt
of an L on either side.
RST (Pins 11/7): (Output) Level-Shifted Reset Output Pin.
This pin should be connected to the Smart Card RST
contact. The RST pin becomes a low impedance to ground
during the Idle state (see the State Diagram). The reset
channel does not become active until the READY signal
goes low indicating that VCC is stable.
Short-circuit protection is provided on the RST pin by
comparing RST with RIN. If these signals differ for several
microseconds then the LTC1755/LTC1756 switch to the
Alarm state. This fault checking is only performed after the
VCC pin has reached its final value (as indicated by the
READY pin).
CLK (Pins 12/8): (Output) Level-Shifted Clock Output Pin.
This pin should be connected to the Smart Card CLK
contact. The CLK pin becomes a low impedance to ground
during the Idle state (see the State Diagram). The clock
channel does not become active until the READY signal
goes low indicating that VCC is stable.
Short-circuit protection is provided on the CLK pin by
comparing CLK with CIN. If these signals differ for several
UU
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PI FU CTIO S LTC1755/LTC1756
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| LTC1755ENG#PBF | 制造商:LT 功能描述: |
| LTC1756EGN | 功能描述:IC SMART CARD 16-SSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| LTC1756EGN#PBF | 功能描述:IC SMART CARD INTERFACE 16SSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| LTC1756EGN#TR | 功能描述:IC SMART CARD INTERFACE 16SSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| LTC1756EGN#TRPBF | 功能描述:IC SMART CARD INTERFACE 16SSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
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