参数资料
型号: LTC2145IUP-14#PBF
厂商: Linear Technology
文件页数: 30/38页
文件大小: 0K
描述: IC ADC DUAL 14BIT 125MSPS 64-QFN
标准包装: 40
位数: 14
采样率(每秒): 125M
数据接口: 并联,串行,SPI
转换器数目: 2
功率耗散(最大): 360mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-WFQFN 裸露焊盘
供应商设备封装: 64-QFN(9x9)
包装: 管件
输入数目和类型: 2 个差分
配用: DC890B-ND - BOARD USB DATA COLLECTION
LTC2145-14/
LTC2144-14/LTC2143-14
36
21454314fa
PACKAGE DESCRIPTION
9 .00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40 ±0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15 ±0.10
7.50 REF
(4-SIDES)
0.75 ±0.05
R = 0.10
TYP
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
7.50 REF
(4 SIDES)
7.15 ±0.05
8.10 ±0.05 9.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
C = 0.35
UP Package
64-Lead Plastic QFN (9mm
9mm)
(Reference LTC DWG # 05-08-1705 Rev C)
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