参数资料
型号: LTC2224IUK#TRPBF
厂商: Linear Technology
文件页数: 24/24页
文件大小: 0K
描述: IC ADC 12BIT 135MSPS SAMPL 48QFN
标准包装: 2,000
位数: 12
采样率(每秒): 135M
数据接口: 并联
转换器数目: 1
功率耗散(最大): 680mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-WFQFN 裸露焊盘
供应商设备封装: 48-QFN-EP(7x7)
包装: 带卷 (TR)
输入数目和类型: 1 个单端,双极; 1 个差分,双极
LTC2224
9
2224fa
AIN+ (Pin 1): Positive Differential Analog Input.
AIN– (Pin 2): Negative Differential Analog Input.
REFHA (Pins 3, 4): ADC High Reference. Bypass to Pins
5, 6 with 0.1
F ceramic chip capacitor, to Pins 9, 10 with
a 2.2
F ceramic capacitor and to ground with a 1F
ceramic capacitor.
REFLB (Pins 5, 6): ADC Low Reference. Bypass to Pins 3,
4 with 0.1
F ceramic chip capacitor. Do not connect to
Pins 9, 10.
REFHB (Pins 7, 8): ADC High Reference. Bypass to Pins
9, 10 with 0.1
F ceramic chip capacitor. Do not connect to
Pins 3, 4.
REFLA (Pins 9, 10): ADC Low Reference. Bypass to Pins
7, 8 with 0.1
F ceramic chip capacitor, to Pins 3, 4 with a
2.2
F ceramic capacitor and to ground with a 1F ceramic
capacitor.
VDD (Pins 11, 12, 14, 46, 47): 3.3V Supply. Bypass to
GND with 0.1
F ceramic chip capacitors. Adjacent pins
can share a bypass capacitor.
GND (Pins 13, 15, 45, 48): ADC Power Ground.
ENC+ (Pin 16): Encode Input. The input is sampled on the
positive edge.
ENC(Pin 17): Encode Complement Input. The input is
sampled on the negative edge. Bypass to ground with
0.1
F ceramic for single-ended ENCODE signal.
SHDN (Pin 18): Shutdown Mode Selection Pin. Connect-
ing SHDN to GND and OE to GND results in normal
operation with the outputs enabled. Connecting SHDN to
GND and OE to VDD results in normal operation with the
outputs at high impedance. Connecting SHDN to VDD and
OE to GND results in nap mode with the outputs at high
impedance. Connecting SHDN to VDD and OE to VDD
results in sleep mode with the outputs at high impedance.
UU
U
PI FU CTIO S
OE (Pin 19): Output Enable Pin. Refer to SHDN pin
function.
CLOCKOUT (Pin 20): Data Valid Output. Latch data on the
falling edge of CLOCKOUT.
D0 – D11 (Pins 21, 24, 25, 26, 29, 30, 31, 34, 35, 36, 39,
40): Digital Outputs. D11 is the MSB.
OGND (Pins 22, 27, 32, 38): Output Driver Ground.
OVDD (Pins 23, 28, 33, 37): Positive Supply for the
Output Drivers. Bypass to ground with 0.1
F ceramic chip
capacitors.
OF (Pin 41): Over/Under Flow Output. High when an over
or under flow has occurred.
MODE (Pin 42): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to 0V selects
offset binary output format and turns the clock duty cycle
stabilizer off. Connecting MODE to 1/3 VDD selects offset
binary output format and turns the clock duty cycle stabi-
lizer on. Connecting MODE to 2/3 VDD selects 2’s comple-
ment output format and turns the clock duty cycle stabi-
lizer on. Connecting MODE to VDD selects 2’s complement
output format and turns the clock duty cycle stabilizer off.
SENSE (Pin 43): Reference Programming Pin. Connecting
SENSE to VCM selects the internal reference and a ±0.5V
input range. VDD selects the internal reference and a ±1V
input range. An external reference greater than 0.5V and
less than 1V applied to SENSE selects an input range of
±VSENSE. ±1V is the largest valid input range.
VCM (Pin 44): 1.6V Output and Input Common Mode Bias.
Bypass to ground with 2.2
F ceramic chip capacitor.
Exposed Pad (Pin 49): ADC Power Ground. The exposed
pad on the bottom of the package needs to be soldered to
ground.
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