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参数资料
| 型号： | LTC2290IUP#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 10/24页 |
| 文件大小： | 0K |
| 描述： | IC ADC DUAL 12BIT 10MSPS 64QFN |
| 标准包装： | 40 |
| 位数： | 12 |
| 采样率（每秒）： | 10M |
| 数据接口： | 并联 |
| 转换器数目： | 2 |
| 功率耗散（最大）： | 138mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-WFQFN 裸露焊盘 |
| 供应商设备封装： | 64-QFN（9x9） |
| 包装： | 管件 |
| 输入数目和类型： | 2 个单端，双极; 2 个差分, 双极 |
LTC2290
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APPLICATIO S I FOR ATIO
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Digital Output Multiplexer
The digital outputs of the LTC2290 can be multiplexed onto
a single data bus. The MUX pin is a digital input that swaps
the two data busses. If MUX is High, Channel A comes out
on DA0-DA11, OFA; Channel B comes out on DB0-DB11,
OFB. If MUX is Low, the output busses are swapped and
Channel A comes out on DB0-DB11, OFB; Channel B comes
out on DA0-DA11, OFA. To multiplex both channels onto
a single output bus, connect MUX, CLKA and CLKB together
(see the Timing Diagram for the multiplexed mode). The
multiplexed data is available on either data bus—the un-
used data bus can be disabled with its OE pin.
Grounding and Bypassing
The LTC2290 requires a printed circuit board with a clean,
unbroken ground plane. A multilayer board with an inter-
nal ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass
capacitors must be located as close to the pins as possible.
Of particular importance is the 0.1
F capacitor between
REFH and REFL. This capacitor should be placed as close
to the device as possible (1.5mm or less). A size 0402
ceramic capacitor is recommended. The large 2.2
F
capacitor between REFH and REFL can be somewhat
further away. The traces connecting the pins and bypass
capacitors must be kept short and should be made as wide
as possible.
The LTC2290 differential inputs should run parallel and
close to each other. The input traces should be as short as
possible to minimize capacitance and to minimize noise
pickup.
Heat Transfer
Most of the heat generated by the LTC2290 is transferred
from the die through the bottom-side exposed pad and
package leads onto the printed circuit board. For good
electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC
board. It is critical that all ground pins are connected to a
ground plane of sufficient area.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC2290UP | 制造商:LINER 制造商全称:Linear Technology 功能描述:Dual 12-Bit, 10Msps Low Power 3V ADC |
| LTC2291 | 制造商:LINER 制造商全称:Linear Technology 功能描述:Dual 12-Bit, 65/40/25Msps Low Power 3V ADCs |
| LTC2291CUP | 制造商:Linear Technology 功能描述:ADC Dual Pipelined 25Msps 12-bit Parallel 64-Pin QFN EP |
| LTC2291CUP#PBF | 功能描述:IC ADC DUAL 12BIT 25MSPS 64QFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
| LTC2291CUP#TRPBF | 功能描述:IC ADC DUAL 12BIT 25MSPS 64QFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
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