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参数资料
| 型号： | LTC3408EDD#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 12/12页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK W/BYPASS TXRX 8-DFN |
| 标准包装： | 121 |
| 应用： | 转换器，WCDMA 功率放大器应用 |
| 输入电压： | 2.5 V ~ 5 V |
| 输出数： | 1 |
| 输出电压： | 0.3 V ~ 3.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN-EP（3x3） |
| 包装： | 管件 |
LTC3408
APPLICATIO S I FOR ATIO
Substituting V OUT = 2.5V, V IN = 4.2V, I L = 120mA and
f = 1.5MHz in Equation (2) gives:
ESR of less than 0.25 ? . In most cases, a ceramic capaci-
tor will satisfy this requirement.
L =
? = 5 . 6 μ H
? 1 –
V OUT
4.7 μ H*
2 . 5 V ? 2 . 5 V ?
1 . 5 MHz ( 120 mA ) ? 4 . 2 V ?
A 4.7 μ H inductor works well for this application. For best
efficiency choose a 660mA or greater inductor with less
than 0.2 ? series resistance.
V IN
2.7V
TO 5V
C IN?
10 μ F
CER
DAC
10k
1000pF
2, 7
5
6
V IN SW
LTC3408
RUN
REF
GND
3, 9
4
V OUT
C OUT**
4.7 μ F
1, 8 CER
3403 F07
* MURATA LQH32CN4R7M11
** TAIYO YUDEN JMK212BJ475MG
?
TAIYO YUDEN JMK212BJ106MN
C IN will require an RMS current rating of at least 0.3A ?
LOAD(MAX)/2 at temperature and C OUT will require an
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
Figure 7
0.675 ± 0.05
R = 0.115
TYP
5
8
0.38 ± 0.10
3.5 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
3.00 ± 0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
(DD8) DFN 1203
0.25 ± 0.05
0.50
0.200 REF
0.75 ± 0.05
4
0.25 ± 0.05
1
0.50 BSC
BSC
2.38 ± 0.10
2.38 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
RELATED PARTS
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
PART NUMBER
LTC3403
DESCRIPTION
1.5MHz, 600mA Synchronous Step-Down Regulator
with Bypass Transistor
COMMENTS
Up to 96% Efficiency, V IN : 2.5V to 5V, V OUT : 0.3V to 3.5V,
I Q = 20 μ A, I SD < 1 μ A, DFN Package
LTC3405/LTC3405A-1.5/ 1.5MHz, 300mA (I OUT ) Synchronous
LTC3405A-1.8 Monolithic Step-Down Regulators
LTC3406B/LTC3406B-1.5/ 1.5MHz, 600mA, (I OUT ) Synchronous Monolithic
LTC3406B-1.8 Step-Down Regulators with Burst Mode Defeat
LTC3407/LTC3407-2 1.5MHz/2.25MHz, 600mA/800mA Dual (I OUT ) Synchronous
Monolithic Step-Down Regulator
LTC5505 ThinSOT RF Power Detector with Buffered Output
and >40dB Dynamic Range
Up to 95% Efficiency, V IN : 2.5V to 5.5V, I Q = 20 μ A,
Fixed Output Voltages Available, ThinSOT TM Package
Up to 95% Efficiency, with Pulse Skipping Mode Enabled,
Fixed Output Voltages Available, ThinSOT Package
Up to 91% Efficiency, V IN : 2.5V to 5.5V, I Q = 4 μ A,
MS10 Package
300MHz to 3GHz, Temperatrue Compensated,
LTC5505-1: –28dBm to 18dBm,
LTC5505-2: –32dBm to 12dBm, V CC = 2.7V to 6V
Burst Mode is a registered trademark of Linear Technology Corporaton. ThinSOT is a trademark of Linear Technology Corporation.
3408f
(408) 432-1900 ● FAX: (408) 434-0507 www.linear.com
12
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
●
LT/TP 0504 1K ? PRINTED IN USA
? LINEAR TECHNOLOGY CORPORATION 2003
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| LTC3409 | 制造商:LINER 制造商全称:Linear Technology 功能描述:600mA Low Vin Buck Regulator in 3mm x 3mm DFN |
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| LTC3409AEDD#PBF | 功能描述:IC REG BUCK SYNC ADJ 0.6A 8DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:2,500 系列:- 类型:升压（升压） 输出类型:可调式 输出数:1 输出电压:1.24 V ~ 30 V 输入电压:1.5 V ~ 12 V PWM 型:电流模式，混合 频率 - 开关:600kHz 电流 - 输出:500mA 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:8-SOIC |
| LTC3409AEDD#TRPBF | 功能描述:IC REG BUCK SYNC ADJ 0.6A 8DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:2,500 系列:- 类型:升压（升压） 输出类型:可调式 输出数:1 输出电压:1.24 V ~ 30 V 输入电压:1.5 V ~ 12 V PWM 型:电流模式，混合 频率 - 开关:600kHz 电流 - 输出:500mA 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:8-SOIC |
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