参数资料
型号: LTC3421EUF#TRPBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC REG BOOST SYNC ADJ 1.5A 24QFN
标准包装: 2,500
类型: 升压(升压)
输出类型: 可调式
输出数: 1
输出电压: 2.4 V ~ 5.25 V
输入电压: 0.5 V ~ 4.5 V
PWM 型: 电流模式,混合
频率 - 开关: 100kHz ~ 3MHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-WFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 24-QFN 裸露焊盘(4x4)
LTC3421
PACKAGE DESCRIPTIO
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.70 ± 0.05
4.50 ± 0.05
2.45 ± 0.05
3.10 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
0.23 TYP
4.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.115
TYP
23 24
(4 SIDES)
PIN 1
TOP MARK
(NOTE 5)
2.45 ± 0.10
(4-SIDES)
0.38 ± 0.10
1
2
(UF24) QFN 0603
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
3421f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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