参数资料
型号: LTC3523EUD-2#PBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC REG BUCK BOOST SYNC ADJ 16QFN
标准包装: 121
类型: 降压(降压),升压(升压)
输出类型: 可调式
输出数: 2
输出电压: 0.62 V ~ 5.5 V
输入电压: 1.8 V ~ 5.5 V
PWM 型: 电流模式,混合
频率 - 开关: 2.4MHz
电流 - 输出: 400mA,600mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
包装: 管件
供应商设备封装: 16-QFN-EP(3x3)
LTC3523/LTC3523-2
PACKAGE DESCRIPTION
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.70 0.05
3.50
0.05
1.45
0.05
2.10
0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
3.00
0.10
0.75
0.05
R = 0.115
TYP
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 45 CHAMFER
(4 SIDES)
15
16
PIN 1
TOP MARK
(NOTE 6)
0.40
1
0.10
1.45
0.10
2
(4-SIDES)
(UD16) QFN 0904
0.200 REF
0.25
0.05
0.00 – 0.05
0.50 BSC
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3523fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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