参数资料
型号: LTC3538EDCB#TRPBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC REG BUCK BOOST SYNC ADJ 8DFN
标准包装: 2,500
类型: 降压(降压),升压(升压)
输出类型: 可调式
输出数: 1
输出电压: 1.8 V ~ 5.25 V
输入电压: 2.4 V ~ 5.5 V
频率 - 开关: 1MHz
电流 - 输出: 800mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 8-DFN(3x2)
LTC3538
PACKAGE DESCRIPTION
DCB Package
8-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)
0.70 ±0.05
3.50 ±0.05
2.10 ±0.05
1.35 ±0.05
1.65 ± 0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.45 BSC
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
5
8
0.40 ± 0.10
1.35 ±0.10
3.00 ±0.10
1.65 ± 0.10
(2 SIDES)
PIN 1 NOTCH
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
4
1
R = 0.20 OR 0.25
× 45° CHAMFER
(DCB8) DFN 0106 REV A
0.23 ± 0.05
0.200 REF
0.75 ±0.05
0.45 BSC
1.35 REF
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3538fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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