参数资料
型号: LTC3546EFE
厂商: LINEAR TECHNOLOGY CORP
元件分类: 稳压器
英文描述: DUAL SWITCHING CONTROLLER, 4000 kHz SWITCHING FREQ-MAX, PDSO28
封装: 4.40 MM, PLASTIC, TSSOP-28
文件页数: 14/28页
文件大小: 356K
代理商: LTC3546EFE
LTC3546
21
3546fb
APPLICATIONS INFORMATION
overall supply performance. For a detailed explanation of
optimizing the compensation components, including a
review of control loop theory, refer to Linear Technology
Application Note 76.
Although a buck regulator is capable of providing the full
output current in dropout, it should be noted that as the
input voltage VINdropstowardVOUT,theloadstepcapability
does decrease due to the decreasing voltage across the
inductor. Applications that require large load step capabil-
ity near dropout should use a different topology such as
SEPIC, Zeta, or single inductor, positive buck boost.
In some applications, a more severe transient can be caused
by switching in loads with large (>1μF) input capacitors.
The discharged input capacitors are effectively put in paral-
lel with COUT, causing a rapid drop in VOUT. No regulator
can deliver enough current to prevent this problem, if the
switch connecting the load has low resistance and is driven
quickly. The solution is to limit the turn-on speed of the load
switch driver. A hot swap controller is designed specically
for this purpose and usually incorporates current limiting,
short-circuit protection, and soft starting.
Efciency Considerations
The percent efciency of a switching regulator is equal to
the output power divided by the input power times 100.
It is often useful to analyze individual losses to determine
what is limiting the efciency and which change would
produce the most improvement. Percent efciency can
be expressed as:
%Efciency = 100% – (P1 + P2 + P3+…)
where P1, P2, etc. are the individual losses as a percent-
age of input power.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of
the losses in LTC3546 circuits: 1) LTC3546 VIN current,
2) switching losses, 3) I2R losses, 4) other losses.
1. The VIN current is the DC supply current given in the
electrical characteristics which excludes MOSFET
driver and control currents. VIN current results in a
small (<0.1%) loss that increases with VIN, even at
no-load.
2. The switching current is the sum of the MOSFET driver
and control currents. The MOSFET driver current re-
sults from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge moves from
VIN to ground. The resulting charge over the switching
period is a current out of VIN that is typically much larger
than the DC bias current. The gate charge losses are
proportional to VIN and thus their effects will be more
pronounced at higher supply voltages.
3. I2R losses are calculated from the DC resistances of
the internal switches, RSW, and the external inductor,
RL. In continuous mode, the average output current
owing through inductor L is “chopped” between the
internal top and bottom switches. Thus, the series
resistance looking into the SW pin is a function of both
top and bottom MOSFET RDS(ON) and the duty cycle
(DC) as follows:
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)
The RDS(ON) for both the top and bottom MOSFETs can
be obtained from the Typical Performance Character-
istics curves. Thus, to obtain I2R losses:
I2R losses = IOUT2(RSW + RL)
Where RL is the resistance of the inductor.
4. Other hidden losses such as copper trace and inter-
nal battery resistances can account for additional ef-
ciency degradations in portable systems. It is very
important to include these “system” level losses in
the design of a system. The internal battery and fuse
resistance losses can be minimized by making sure
that CIN has adequate charge storage and very low
ESR at the switching frequency. Other losses including
diode conduction losses during dead-time and inductor
core losses generally account for less than 2% total
additional loss.
Thermal Considerations
The LTC3546 requires the backplane metal (Pin 29) to be
well soldered to the PC board. This gives the UFD pack-
age exceptional thermal properties, compared to similar
packages of this size, making it difcult in normal opera-
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