参数资料
型号: LTC3634IFE#PBF
厂商: Linear Technology
文件页数: 24/28页
文件大小: 0K
描述: IC CONV DDR DDR2 DDR3 28TSSOP
标准包装: 50
应用: 转换器,DDR,DDR2,DDR3
输入电压: 1.4 V ~ 15 V
输出数: 2
输出电压: 0.6 V ~ 3 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.173",4.40mm 宽)裸露焊盘
供应商设备封装: 28-TSSOP 裸露焊盘
包装: 管件
LTC3634
APPLICATIONS INFORMATION
RUN1 IN2
RT
V IN
3.6V TO 15V
R3
324k
R COMP1
26.7k
C COMP1
560pF
R COMP2
18k
C1
47μF
× 2
C2
2.2μF
C4
10pF
C5
10pF
V V IN1
RUN2
LTC3634
INTV CC
PHMODE
MODE/SYNC
ITH1
ITH2
SGND PGND
BOOST1
SW1
V ON1
VDDQIN
V FB1
BOOST2
SW2
V FB2
V ON2
VTTR
3634 F09
0.1μF
R1
12.1k
0.1μF
V REF
0.9V
0.01μF
L1
1.5μH
R2
24.3k
L2
0.82μH
V DDQ
1.8V
C OUT1
100μF
× 2
V TT
0.9V
C OUT2
100μF
× 4
C COMP2
910pF
Figure 9. Design Example Circuit
VIA TO BOOST1
VIA TO V ON1 /R2 (NOT SHOWN)
V OUT1
C OUT1
VIA TO V ON1 AND R2 (NOT SHOWN)
VIAS TO GROUND
PLANE
SGND (TO NONPOWER
COMPONENTS)
L1
SW1
C BOOST1
C BOOST2
C IN
C IN
GND
VIAS TO GROUND
PLANE
V IN
VIAS TO GROUND
PLANE
SGND (TO NONPOWER
COMPONENTS)
VIAS TO GROUND
PLANE
GND
C IN
C OUT1
L1
SW1
SW2
V OUT1
VIA TO BOOST1
C BOOST1
V IN
C BOOST2
SW2
L2
C OUT2
GND
VIAS TO GROUND
PLANE
V OUT2
GND
VIAS TO GROUND
PLANE
C IN
C OUT2
L2
VIA TO BOOST2
V OUT2
3634 F11
VIA TO BOOST2
3634 F10
VIA TO V ON2 AND V FB2 (NOT SHOWN)
VIA TO V ON2 AND V FB2 (NOT SHOWN)
Figure 10. Example of Power Component Layout
for QFN Package
Figure 11. Example of Power Component Layout
for TSSOP Package
3634fb
24
For more information www.linear.com/LTC3634
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