参数资料
型号: LTC3634IFE#PBF
厂商: Linear Technology
文件页数: 25/28页
文件大小: 0K
描述: IC CONV DDR DDR2 DDR3 28TSSOP
标准包装: 50
应用: 转换器,DDR,DDR2,DDR3
输入电压: 1.4 V ~ 15 V
输出数: 2
输出电压: 0.6 V ~ 3 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.173",4.40mm 宽)裸露焊盘
供应商设备封装: 28-TSSOP 裸露焊盘
包装: 管件
LTC3634
PACKAGE DESCRIPTION
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)
0.70 ± 0.05
4.50 ± 0.05
3.10 ± 0.05
2.50 REF
2.65 ± 0.05
3.65 ± 0.05
0.25 ± 0.05
0.50 BSC
3.50 REF
4.10 ± 0.05
5.50 ± 0.05
PACKAGE OUTLINE
4.00 ± 0.10
RECOMMENDEDSOLDERPADPITCHANDDIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.75 ± 0.05
(2 SIDES)
R = 0.05
TYP
2.50 REF
R = 0.115
TYP
27
28
PIN 1 NOTCH
R = 0.20 OR 0.35
× 45 ° CHAMFER
5.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
3.50 REF
3.65 ± 0.10
2.65 ± 0.10
0.40 ± 0.10
1
2
(UFD28) QFN 0506 REV B
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3634fb
For more information www.linear.com/LTC3634
25
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