参数资料
型号: LTC3879EUD#PBF
厂商: Linear Technology
文件页数: 12/28页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 16-QFN
标准包装: 121
PWM 型: 电流模式
输出数: 1
频率 - 最大: 2MHz
占空比: 90%
电源电压: 4 V ~ 38 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 16-WFQFN 裸露焊盘
包装: 管件
产品目录页面: 1336 (CN2011-ZH PDF)
LTC3879
APPLICATIONS INFORMATION
The resulting power dissipation in the MOSFETs at maxi-
V IN
? ( C MILLER )
+ V I N 2 ?
? ?
mum output current are:
P TOP = D TOP ? I OUT ( MAX ) 2 ? ρ τ ( TOP ) ? R DS ( ON )( MAX )
? I OUT(MAX ) ?
2
V GS
MILLER EFFECT
a b
Q IN
C MILLER = (Q B – Q A )/V DS
V
+
V GS
+ V DS
3879 F02
+
V MILLER ? OSC
? V INTVC C – V MILLER
C MILLER =
( )
t ON =
? DR TGHIGH DR TGLOW ?
? ? f
P BOT = D BO T ? I OUT ( MAX ) 2 ? ρ τ ( BOT ) ? R DS ( ON )( MAX )
DR TGHIGH is pull-up driver resistance and DR TGLOW is the
TG driver pull-down resistance. V MILLER is the Miller ef-
fect V GS voltage and is taken graphically from the power
MOSFET data sheet.
MOSFET input capacitance is a combination of several
components but can be taken from the typical “gate charge”
curve included on the most data sheets (Figure 2). The
curve is generated by forcing a constant input current
into the gate of a common source, current source, loaded
stage and then plotting the gate versus time. The initial
slope is the effect of the gate-to-source and gate-to-drain
capacitance. The ?at portion of the curve is the result of the
Miller multiplication effect of the drain-to-gate capacitance
as the drain drops the voltage across the current source
load. The upper sloping line is due to the drain-to-gate
accumulation capacitance and the gate-to-source capaci-
tance. The Miller charge (the increase in coulombs on the
horizontal axis from a to b while the curve is ?at) is speci-
?ed from a given V DS drain voltage, but can be adjusted
for different V DS voltages by multiplying by the ratio of
the application V DS to the curve speci?ed V DS values. A
way to estimate the C MILLER term is to take the change in
gate charge from points a and b or the parameter Q GD on
a manufacturers data sheet and divide by the speci?ed
V DS test voltage, V DS(TEST) .
Q GD
V DS ( TEST )
Figure 2. Gate Charge Characteristic
Both MOSFETs have I 2 R power loss, and the top MOSFET
includes an additional term for transition loss, which are
highest at high input voltages. For V IN < 20V, the high cur-
rent ef?ciency generally improves with larger MOSFETs,
while for V IN > 20V, the transition losses rapidly increase
to the point that the use of a higher R DS(ON) device with
lower C MILLER actually provides higher ef?ciency. The
synchronous MOSFET losses are greatest at high input
voltage when the top switch duty factor is low or during
a short-circuit when the synchronous switch is on close
to 100% of the period.
Operating Frequency
The choice of operating frequency is a tradeoff between
ef?ciency and component size. Lowering the operating fre-
quency improves ef?ciency by reducing MOSFET switching
losses but requires larger inductance and/or capacitance
to maintain low output ripple voltage. Conversely, raising
the operating frequency degrades ef?ciency but reduces
component size.
The operating frequency of LTC3879 applications is de-
termined implicitly by the one-shot timer that controls the
on-time, t ON , of the top MOSFET switch. The on-time is
set by the current into the I ON pin according to:
0 . 7 V
10 pF
I ION
Tying a resistor R ON from V IN to the I ON pin yields an
on-time inversely proportional to V IN . For a step-down
converter, this results in pseudo ?xed frequency operation
as the input supply varies.
C MILLER is the most important selection criteria for deter-
mining the transition loss term in the top MOSFET but is
not directly speci?ed on MOSFET data sheets.
f OP =
V OUT
0 . 7 V ? R ON ( 10 pF
)
[ Hz ]
3879f
12
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