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参数资料
| 型号： | LTC4216IMS#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 24/26页 |
| 文件大小： | 311K |
| 描述： | IC CNTRLR HOT SWAP 10-MSOP |
| 标准包装： | 50 |
| 类型： | 热交换控制器 |
| 应用： | 通用 |
| 内部开关： | 无 |
| 电源电压： | 2.3 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 管件 |
LTC4216
24
4216fa
For more information www.linear.com/LTC4216
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.00 ?.10
(2 SIDES)
3.00 ?.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE
DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT,
SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40 ?.10
BOTTOM VIEWEXPOSED PAD
1.70 ?.10
0.75 ?.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
1
6
12
7
PIN 1 NOTCH
R = 0.20 OR
0.35 ?45?/DIV>
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 0.05
(UE12/DE12) DFN 0806 REV D
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 ?.05
0.70 ?.05
3.60 ?.05
PACKAGE OUTLINE
3.30 ?.10
0.25 ?.05
0.50 BSC
1.70 ?.05
3.30 ?.05
0.50 BSC
0.25 ?.05
DE/UE Package
12-Lead Plastic DFN (4mm ?/SPAN> 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.53 ?0.152
(.021 ?.006)
0.18
(.007)
0.254
(.010)
0? 6?TYP
DETAIL A
DETAIL A
GAUGE PLANE
5.23
(.206)
MIN
3.20 3.45
(.126 .136)
0.889 ?0.127
(.035 ?.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ?0.038
(.0120 ?.0015)
TYP
0.50
(.0197)
BSC
MSOP (MS) 0307 REV E
SEATING
PLANE
1.10
(.043)
MAX
0.17 0.27
(.007 .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90 ?0.152
(.193 ?.006)
0.497 ?0.076
(.0196 ?.003)
REF
8
9
10
7 6
3.00 ?0.102
(.118 ?.004)
(NOTE 3)
3.00 ?0.102
(.118 ?.004)
(NOTE 4)
0.1016 ?0.0508
(.004 ?.002)
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E)
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