参数资料
型号: LTC4222IUH#TRPBF
厂商: Linear Technology
文件页数: 29/32页
文件大小: 339K
描述: IC CTRLR DUAL HOT SWAP 32-QFN
标准包装: 2,500
类型: 热交换控制器
应用: 通用
内部开关:
电源电压: 2.9 V ~ 29 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-WFQFN 裸露焊盘
供应商设备封装: 32-QFN 裸露焊盘(5x5)
包装: 带卷 (TR)
LTC4222
29
4222fb
PACKAGE DESCRIPTION
UH Package
32-Lead Plastic QFN (5mm ?/SPAN> 5mm)
(Reference LTC DWG # 05-08-1693 Rev D)
5.00 ?0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
  M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
  MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
  ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ?0.10
31
1
2
32
BOTTOM VIEWEXPOSED PAD
3.50 REF
(4-SIDES)
3.45 ?0.10
3.45 ?0.10
0.75 ?0.05
R = 0.115
TYP
0.25 ?0.05
(UH32) QFN 0406 REV D
0.50 BSC
0.200 REF
0.00  0.05
0.70 ?.05
3.50 REF
(4 SIDES)
4.10 ?.05
5.50 ?.05
0.25 ?0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 ?45?CHAMFER
R = 0.05
TYP
3.45 ?0.05
3.45 ?0.05
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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