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| 型号： | LTC4267CGN#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 20/32页 |
| 文件大小： | 0K |
| 描述： | IC POE 802.3AF INTERFACE 16SSOP |
| 标准包装： | 2,500 |
| 控制器类型： | 以太网供电控制器（POE） |
| 接口： | IEEE 802.3af |
| 电流 - 电源： | 3mA |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SSOP |
| 包装： | 带卷 (TR) |
| 相关产品： | 732-2437-6-ND - TRANS FLYBACK POE 40UH SMD 732-2436-6-ND - TRANS FLYBACK POE 35UH SMD 732-2435-6-ND - TRANS FLYBACK POE 127UH SMD 732-2434-6-ND - TRANS FLYBACK POE 127UH SMD 732-2433-6-ND - TRANS FLYBACK POE 127UH SMD 732-2432-6-ND - TRANS FLYBACK POE 127UH SMD 732-2431-6-ND - TRANS FLYBACK POE 127UH SMD 732-2430-6-ND - TRANS FLYBACK POE 127UH SMD 732-2437-1-ND - TRANS FLYBACK POE 40UH SMD 732-2436-1-ND - TRANS FLYBACK POE 35UH SMD 更多... |
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LTC4267
27
4267fc
with minimum trace lengths and minimum capacitance.
In a nonisolated application, R1, and R2 should be placed
as close as possible to the VFB pin of the LTC4267 and
CC should be placed close to the ITH/RUN pin of the
LTC4267.
In essence, a tight overall layout of the high current loop
and careful attention to current density will ensure suc-
cessful operation of the LTC4267 in a PD.
The PD interface section of the LTC4267 is relatively im-
mune to layout problems. Excessive parasitic capacitance
on the RCLASS pin should be avoided. If using the DHC
package, include an electrically isolated heat sink to which
the exposed pad on the bottom of the package can be
soldered. For optimum thermal performance, make the
heat sink as large as possible. The SIGDISA pin is adjacent
to the VPORTP pin and any coupling, whether resistive
APPLICATIO S I FOR ATIO
WU
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or capacitive may inadvertently disable the signature
resistance. To ensure consistent behavior, the SIGDISA
pin should be electrically connected and not left oating.
Voltages in a PD can be as large as – 57V, so high voltage
layout techniques should be employed.
Electro Static Discharge and Surge Protection
The LTC4267 is specied to operate with an absolute
maximum voltage of –100V and is designed to tolerate
brief overvoltage events. However, the pins that interface
to the outside world (primarily VPORTN and VPORTP) can
routinely see peak voltages in excess of 10kV. To protect
the LTC4267, it is highly recommended that a transient
voltage suppressor be installed between the diode bridge
and the LTC4267 (D3 in Figure 2).
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC4267IDHC | 制造商:Linear Technology 功能描述:Hot Swap Controller 1-CH -57V 16-Pin DFN EP |
| LTC4267IDHC#PBF | 功能描述:IC POE 802.3AF INTERFACE 16-DFN RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C，串行，SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN（4x4） 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND |
| LTC4267IDHC#TRPBF | 功能描述:IC POE 802.3AF INTERFACE 16-DFN RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C，串行，SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN（4x4） 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND |
| LTC4267IDHC-1#PBF | 制造商:Linear Technology 功能描述:Bulk |
| LTC4267IDHC-3#PBF | 功能描述:IC POE 802.3AF W/REG 16-DFN RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C，串行，SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN（4x4） 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND |
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