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参数资料
| 型号： | LTC4365CTS8#TRMPBF |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 电源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 |
| 封装： | LEAD FREE, PLASTIC, MO-193, TSOT-23, 8 PIN |
| 文件页数： | 7/16页 |
| 文件大小： | 369K |
| 代理商： | LTC4365CTS8#TRMPBF |
LTC4365
15
4365f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637)
DDB Package
8-Lead Plastic DFN (3mm
× 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.22 – 0.36
8 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
TS8 TSOT-23 0802
2.90 BSC
(NOTE 4)
0.65 BSC
1.95 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.52
MAX
0.65
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
2.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
0.56
± 0.05
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
2.15
±0.05
(2 SIDES)
3.00
±0.10
(2 SIDES)
1
4
8
5
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB8) DFN 0905 REV B
0.25
± 0.05
2.20
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61
±0.05
(2 SIDES)
1.15
±0.05
0.70
±0.05
2.55
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
PIN 1
R = 0.20 OR
0.25
× 45°
CHAMFER
0.50 BSC
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC4365HDDB#PBF | 制造商:Linear Technology 功能描述:Bulk 制造商:Linear Technology 功能描述:PROTECTION CONTROLLER 2.5V TO 制造商:Linear Technology 功能描述:PROTECTION CONTROLLER, 2.5V TO 34V, DFN-8; Controller Applications:Automotive, Industrial Automation, Laptops, Portable Instrumentation; Internal Switch:No; Supply Voltage Min:2.5V; Supply Voltage Max:34V; Digital IC Case Style:DFN ;RoHS Compliant: Yes |
| LTC4365HDDB#TRMPBF | 功能描述:IC OVERVOLTAGE PROTECT 8-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:- 标准包装:1 系列:- 应用:手持/移动设备 电流 - 电源:- 电源电压:3 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-LLP-EP（4x4） 包装:Digi-Reel® 配用:LP3905SD-30EV-ND - BOARD EVALUATION LP3905SD-30 其它名称:LP3905SD-30DKR |
| LTC4365HDDB#TRPBF | 功能描述:IC OVERVOLTAGE PROTECT 8-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:- 标准包装:1 系列:- 应用:手持/移动设备 电流 - 电源:- 电源电压:3 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-LLP-EP（4x4） 包装:Digi-Reel® 配用:LP3905SD-30EV-ND - BOARD EVALUATION LP3905SD-30 其它名称:LP3905SD-30DKR |
| LTC4365HDDB-1#TRMPBF | 制造商:Linear Technology 功能描述:IC OVERVOLTAGE PROTECT 8-DFN 制造商:Linear Technology 功能描述:IC, SUPPLY PROTECTION CONTROL, DFN-8 制造商:Linear Technology 功能描述:OV, UV & REVERSE CONTROLLER, DFN-8, Brief Features:-, Supply Voltage Min:2.5V, Supply Voltage Max:34V, Operating Temperature Min:-40C, Operating Temperature Max:125C, Digital IC Case Style:DFN, No. of Pins:8, Package / Case:8-DFN |
| LTC4365HDDB-1#TRPBF | 制造商:Linear Technology 功能描述:IC OVERVOLTAGE PROTECT 8-DFN 制造商:Linear Technology 功能描述:OV, UV & REVERSE CONTROLLER, DFN-8, Brief Features:-, Supply Voltage Min:2.5V, Supply Voltage Max:34V, Operating Temperature Min:-40C, Operating Temperature Max:125C, Digital IC Case Style:DFN, No. of Pins:8, Package / Case:8-DFN |
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