参数资料
型号: LTC4413EDD-2#PBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC IDEAL DIODE DUAL 10-DFN
标准包装: 121
应用: 手持/移动设备
FET 型: P 沟道
输出数: 2
内部开关:
延迟时间 - 开启: 11µs
延迟时间 - 关闭: 2µs
电源电压: 2.5 V ~ 5.5 V
电流 - 电源: 40µA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
供应商设备封装: 10-DFN(3x3)
包装: 管件
LTC4413-1/LTC4413-2
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
0.70 0.05
3.55 0.05
1.65 0.05
2.15 0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25
0.05
0.50
BSC
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 0.10
(4 SIDES)
1.65
0.10
(2 SIDES)
R = 0.125
TYP
6
10
0.40
0.10
PIN 1
TOP MARK
(SEE NOTE 6)
5
1
(DD) DFN REV B 0309
0.200 REF
0.75 0.05
0.25
0.05
0.50 BSC
2.38 0.10
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
441312fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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