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参数资料
| 型号： | LTC6912HGN-2#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 16/24页 |
| 文件大小： | 0K |
| 描述： | IC PGA DIGITAL R-R DUAL 16SSOP |
| 标准包装： | 2,500 |
| 放大器类型： | 可编程增益 |
| 电路数： | 2 |
| 输出类型： | 满摆幅 |
| 转换速率： | 26 V/µs |
| 增益带宽积： | 30MHz |
| 电压 - 输入偏移： | 125µV |
| 电流 - 电源： | 2.25mA |
| 电流 - 输出 / 通道： | 35mA |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 10.5 V，±2.7 V ~ 5.25 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SSOP |
| 包装： | 带卷 (TR) |
LTC6912
23
6912fa
DE/UE Package
12-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1695)
4.00
±0.10
(2 SIDES)
3.00
±0.10
(2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.38
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.20
TYP
0.25
± 0.05
3.30
±0.10
(2 SIDES)
1
6
12
7
0.50
BSC
PIN 1
NOTCH
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0603
0.25
± 0.05
3.30
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70
±0.05
(2 SIDES)
2.20
±0.05
0.50
BSC
0.65
±0.05
3.50
±0.05
PACKAGE OUTLINE
U
PACKAGE DESCRIPTIO
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015
± .004
(0.38
± 0.10)
× 45°
0
° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165
±.0015
.045
±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC6912IDE-1 | 制造商:LINER 制造商全称:Linear Technology 功能描述:Dual Programmable Gain Amplifiers with Serial Digital Interface |
| LTC6912IDE-1#PBF | 功能描述:IC PGA DIGITAL R-R DUAL 12-DFN RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:100 系列:- 放大器类型:通用 电路数:1 输出类型:- 转换速率:0.2 V/µs 增益带宽积:- -3db带宽:- 电流 - 输入偏压:100pA 电压 - 输入偏移:30µV 电流 - 电源:380µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):±2 V ~ 18 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SO 包装:管件 |
| LTC6912IDE-1#TRPBF | 功能描述:IC PGA DIGITAL R-R DUAL 12-DFN RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:- 放大器类型:通用 电路数:1 输出类型:满摆幅 转换速率:0.11 V/µs 增益带宽积:350kHz -3db带宽:- 电流 - 输入偏压:4nA 电压 - 输入偏移:20µV 电流 - 电源:260µA 电流 - 输出 / 通道:20mA 电压 - 电源，单路/双路(±):2.7 V ~ 36 V，±1.35 V ~ 18 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SO 包装:带卷 (TR) |
| LTC6912IDE-2 | 制造商:LINER 制造商全称:Linear Technology 功能描述:Dual Programmable Gain Amplifiers with Serial Digital Interface |
| LTC6912IDE-2#PBF | 功能描述:IC PGA DIGITAL R-R DUAL 12-DFN RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:100 系列:- 放大器类型:通用 电路数:1 输出类型:- 转换速率:0.2 V/µs 增益带宽积:- -3db带宽:- 电流 - 输入偏压:100pA 电压 - 输入偏移:30µV 电流 - 电源:380µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):±2 V ~ 18 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SO 包装:管件 |
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