参数资料
型号: LTM4608IV#PBF
厂商: Linear Technology
文件页数: 20/26页
文件大小: 0K
描述: IC DC/DC UMODULE 8A 68-LGA
产品培训模块: Power Module vs. Discrete DC to DC
软件下载: LTM4608 Spice Model
产品目录绘图: LTM Series_9x15x2.8
设计资源: LTM4608IV#PBF Footprint.bxl
特色产品: μModule Products
标准包装: 170
系列: µModule®
类型: 非隔离(POL)
输出数: 1
电压 - 输入(最小): 2.7V
电压 - 输入(最大): 5.5V
Voltage - Output 1: 0.6 ~ 5 V
电流 - 输出(最大): 8A
安装类型: 表面贴装
封装/外壳: 68-LGA
尺寸/尺寸: 0.59" L x 0.35" W x 0.11" H(15.0mm x 9.0mm x 2.8mm)
包装: 托盘
工作温度: -40°C ~ 85°C
效率: 98%
产品目录页面: 2711 (CN2011-ZH PDF)
LTM4608
APPLICATIONS INFORMATION
Safety Considerations
The LTM4608 modules do not provide isolation from V IN
to V OUT . There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4608 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
?  Use  large  PCB  copper  areas  for  high  current  path, 
including V IN , GND and V OUT . It helps to minimize the
PCB conduction loss and thermal stress.
GND
GND
?  Place high frequency ceramic input and output capaci -
tors next to the V IN , GND and V OUT pins to minimize
high frequency noise.
?  Place a dedicated power ground layer underneath the 
unit.
?  To minimize the via conduction loss and reduce module 
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
?  Do not put vias directly on the pads, unless they are 
capped.
?  Use a separated SGND ground copper area for com -
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
Figure 17 gives a good example of the recommended layout.
V OUT
C OUT
C OUT
C OUT
C IN
V IN
C IN
GND
4608 F17
Figure 17. Recommended PCB Layout
For easier board layout and PCB assembly due to increased
spacing between land grid pads, please refer to the LTM4608A.
4608fd
20
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