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参数资料
| 型号： | LTM8032MPV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 14/26页 |
| 文件大小： | 0K |
| 描述： | IC BUCK ADJ 2A 71LGA |
| 产品培训模块： | Wide Temperature DC/DC Converter µModules High Voltage µModule DC/DC Regulators Power Module vs. Discrete DC to DC µModule® Family of EN55022 Class B Certified Regulators |
| 软件下载： | LTM8032 Spice Model |
| 产品目录绘图： | LTM Series_9x15x2.8 |
| 设计资源： | DC1386B Design Files LTM8032MPV#PBF Footprint.bxl |
| 特色产品： | μModule Products |
| 标准包装： | 170 |
| 系列： | µModule® |
| 类型： | 非隔离（POL） |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 3.6V |
| 电压 - 输入（最大）： | 36V |
| Voltage - Output 1： | 0.8 ~ 10 V |
| 电流 - 输出（最大）： | 2A |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 71-LGA |
| 尺寸/尺寸： | 0.59" L x 0.35" W x 0.11" H（15.0mm x 9.0mm x 2.8mm） |
| 包装： | 托盘 |
| 工作温度： | -55°C ~ 125°C |
| 产品目录页面： | 2711 (CN2011-ZH PDF) |
LTM8032
APPLICATIONS INFORMATION
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8032. The LTM8032 is neverthe-
less a switching power supply and care must be taken to
minimize EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 4
for a suggested layout.
Ensure that the grounding and heat sinking are acceptable.
A few rules to keep in mind are:
1. Place the R ADJ and R T resistors as close as possible to
their respective pins.
2. Place the C IN capacitor as close as possible to the V IN
and GND connection of the LTM8032. If a capacitor
is connected to the FIN terminals, place it as close
GND
as possible to the FIN terminals, such that its ground
connection is as close as possible to that of the C IN
capacitor.
3. Place the C OUT capacitor as close as possible to the
V OUT and GND connection of the LTM8032.
4. Place the C IN and C OUT capacitors such that their
ground currents flow directly adjacent or underneath
the LTM8032.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8032.
6. Use vias to connect the GND copper area to the board’s
internal ground plane. Liberally distribute these GND vias
to provide both a good ground connection and thermal
path to the internal planes of the printed circuit board.
C OUT
AUX
BIAS
FIN
SYNC
RUN/SS
V IN
OPTIONAL
FIN
CAPACITOR
V OUT
C IN
GND
8032 F04
Figure 4. Layout Showing Suggested External Components,
GND Plane and Thermal Vias (LGA Package)
8032fg
14
For more information www.linear.com/LTM8032
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTM8032MPY#PBF | 功能描述:IC DC/DC UMODULE 2A 71BGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:66V 电压 - 输入（最大）:160V Voltage - Output 1:12V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:50W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9-FinMod 尺寸/尺寸:4.60" L x 1.86" W x 0.79" H（116.8mm x 47.2mm x 20.1mm） 包装:散装 工作温度:-25°C ~ 85°C 效率:* 电源（瓦特）- 最大:* |
| LTM8033 | 制造商:LINER 制造商全称:Linear Technology 功能描述:Ultralow EMI 28VIN, 6A DC/DC μModule Regulator |
| LTM8033EV#PBF | 功能描述:IC DC-DC UMODULE BUCK 3A 76-LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:55V 电压 - 输入（最大）:100V Voltage - Output 1:5.8V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:100W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9 针半砖 BusMod 尺寸/尺寸:2.36" L x 2.28" W x 1.08" H（59.9mm x 57.9mm x 27.4mm） 包装:散装 工作温度:-25°C ~ 100°C 效率:* 电源（瓦特）- 最大:* |
| LTM8033EVPBF | 制造商:Linear Technology 功能描述:Low Noise EMC 36V 3A DC/DC uModule LGA76 |
| LTM8033EV-PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Ultralow Noise EMC 36VIN, 3A DC/DC μModule Regulator |
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