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参数资料
| 型号： | LTM8052IV#PBF |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 稳压器 |
| 英文描述： | SWITCHING REGULATOR, 1000 kHz SWITCHING FREQ-MAX, PBGA81 |
| 封装： | 15 X 11.25 MM, 2.82 MM HEIGHT, ROHS COMPLIANT, MO-222, LGA-81 |
| 文件页数： | 14/28页 |
| 文件大小： | 350K |
| 代理商： | LTM8052IV#PBF |
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LTM8052
21
8052f
Figure 7. Thermal Resistances Among Module Device,
Printed Circuit Board and Environment
8052 F07
MODULE DEVICE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION
AMBIENT
CASE (BOTTOM)-TO-BOARD
RESISTANCE
θJB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
Module regulator and into the board, and is really the
sum of the
θJCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a 2-sided,
2-layer board. This board is described in JESD 51-9.
Giventhesedefinitions,itshouldnowbeapparentthatnone
of these thermal coefficients reflects an actual physical
operating condition of a Module regulator. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 7.
The blue resistances are contained within the Module
device, and the green are outside.
The die temperature of the LTM8052 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8052. The bulk of the heat flow out of the LTM8052
is through the bottom of the module and the LGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.
applicaTions inForMaTion
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTM8061 | 制造商:LINER 制造商全称:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
| LTM8061EV-4.1#PBF | 功能描述:IC BATTERY CHARGER 4.1V 77-LGA RoHS:是 类别:集成电路 (IC) >> PMIC - 电池管理 系列:µModule® 其它有关文件:STC3100 View All Specifications 特色产品:STC3100 - Battery Monitor IC 标准包装:4,000 系列:- 功能:燃料，电量检测计/监控器 电池化学:锂离子（Li-Ion） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MiniSO 包装:带卷 (TR) 其它名称:497-10526-2 |
| LTM8061EV-4.1PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
| LTM8061EV-4.2#PBF | 功能描述:IC BATTERY CHARGER 4.2V 77-LGA RoHS:是 类别:集成电路 (IC) >> PMIC - 电池管理 系列:µModule® 其它有关文件:STC3100 View All Specifications 特色产品:STC3100 - Battery Monitor IC 标准包装:4,000 系列:- 功能:燃料，电量检测计/监控器 电池化学:锂离子（Li-Ion） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MiniSO 包装:带卷 (TR) 其它名称:497-10526-2 |
| LTM8061EV-4.2PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
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