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参数资料
| 型号： | LX1801CLQ |
| 厂商： | MICROSEMI CORP |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PQCC16 |
| 封装： | 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MLPQ-16 |
| 文件页数： | 5/12页 |
| 文件大小： | 255K |
| 代理商： | LX1801CLQ |
LX1801
PRODUCTION DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2005
Rev. 1.0, 5/4/2006
WWW
.Microse
m
i
.CO
M
SMBus to Analog & Digital System Interface
TM
ABSOLUTE MAXIMUM RATINGS
Supply Input Voltage ........................................................................-0.3V to 7.0V
Input and Output Pins .......................................................................-0.3V to 7.0V
Operating Temperature Range. ……………………………………...-40 to 85
°C
Maximum Operating Junction Temperature ................................................ 150
°C
Storage Temperature Range...........................................................-65
°C to 150°C
Peak Package Solder Reflow Temp (40 seconds max. exposure)..... 260°C(+0,-5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
TH ERMAL DATA
LQ Plastic 3x3 mm MLPQ 16-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θJA
33.3
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAGE PIN OUT
ALS_IN
1
2
3
4
56
7
8
9
10
11
12
13
14
15
16
SDA
SCL
PWM_IN
VS
S
OV
R_C
U
R
LM
P_
ON
LM
P_C
BRITE_OUT
EN_OUT
FLT_DLY
VSS
VD
D
VR
EF
_IN
V_
BO
T
AD
R0
LQ PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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