参数资料
| 型号： | M1A3P1000-FGG144I |
| 厂商： | Microsemi SoC |
| 文件页数： | 5/12页 |
| 文件大小： | 0K |
| 描述： | IC FPGA M1 1KB FLASH 1M 144FPGA |
| 标准包装： | 160 |
| 系列： | ProASIC3 |
| RAM 位总计： | 147456 |
| 输入/输出数： | 97 |
| 门数： | 1000000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 144-LBGA |
| 供应商设备封装： | 144-FPBGA（13x13） |
ARM CortexTM-M1
2P ro d u c t B r i e f
Figure 1 shows an ARM Cortex-M1 processor with debug block diagram.
The NVIC is closely coupled to the ARM Cortex-M1 core
to achieve low-latency interrupt processing. The versions
currently available for use in M1 devices support 1
interrupt with 4 levels of priority. Future versions will
support up to 32 interrupts. To simplify software
development, the processor state is automatically saved
on interrupt entry, and restored on interrupt exist, with
no instruction overhead.
The ARM Cortex-M1 Thumb instruction set’s 16-bit
instruction length allows it to approach twice the density
in memory of standard 32-bit ARM code while retaining
most of the ARM performance advantage over a
traditional 16-bit processor using 16-bit registers. This is
possible because Thumb code operates on the 32-bit
register set in the processor. Thumb code is able to
provide up to 65% of the code size of ARM, and 160% of
the performance of an equivalent ARM processor
connected to a 16-bit memory system.
Figure 1 Processor with Debug Block Diagram
Processor with Debug
AHB-PPB
NVIC
Debug Subsystem
AHB Decoder
AHB Multiplexer
AHB Matrix
Debug ITCM Interface
Debug DTCM Interface
Breakpoint Unit
Data Watchpoint Unit
Debug Control
ROM Table
Internal PPB Signals
External Bus Signals
DAP
AHB-AP
SWJ-DP
Memory Interface
ITCM
DTCM
Core
Dbg
AHB Master
NVIC Interrupt Interface External Interface
Debug Port
相关PDF资料 |
PDF描述 |
|---|---|
| A3P1000-FGG144I | IC FPGA 1KB FLASH 1M 144-FBGA |
| RMM36DTAD | CONN EDGECARD 72POS R/A .156 SLD |
| A54SX32A-TQG144A | IC FPGA SX 48K GATES 144-TQFP |
| A3PE600-1FGG256I | IC FPGA 600000 GATES 256-FBGA |
| ASM36DRYI | CONN EDGECARD 72POS DIP .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| M1A3P1000-FGG144M | 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3 FAMILY 1M GATES 130NM (CMOS) TECHNOLOGY 1.5V - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 1M GATES W/M1 144GBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 97 I/O 144GBGA |
| M1A3P1000-FGG144PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| M1A3P1000-FGG256 | 功能描述:IC FPGA M1 1KB FLASH 1M 256FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| M1A3P1000-FGG256I | 功能描述:IC FPGA M1 1KB FLASH 1M 256FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| M1A3P1000-FGG484 | 功能描述:IC FPGA M1 1KB FLASH 1M 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
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