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参数资料
| 型号： | M7705 |
| 厂商： | OKI SEMICONDUCTOR CO., LTD. |
| 元件分类： | Codec |
| 英文描述： | 4ch Single Rail CODEC |
| 中文描述： | 4路单铁编解码器 |
| 文件页数： | 20/20页 |
| 文件大小： | 144K |
| 代理商： | M7705 |
Semiconductor
MSM7705-01/02/03
20/20
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
m
m or more
0.41 TYP.
QFP44-P-910-0.80-2K
Mirror finish
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